ATMOSPHERIC PRESSURE PLASMA ELECTRODE

• US 20100009098A1
• Filed: 09/27/2007
• Published: 01/14/2010
• Est. Priority Date: 10/03/2006
• Status: Abandoned Application

• Current Assignee: Dow Global Technologies LLC (Dow, Inc.)
• Original Assignee: Dow Global Technologies LLC (Dow, Inc.)
• Inventors: Bai, Hua, Weikart, Christopher M.
• Application Number:
  US12/441,854
• Publication Number:
  US 20100009098A1
• Time in Patent Office: Days
• US Class Current: 427/569
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: H01J 37/3255 Material
• CPC Class Codes: H01J 37/32825 Working under atmospheric pressure or higher

Abstract

An improved electrode useful for modifying a substrate using corona discharge dielectric barrier discharge or glow discharge plasma treatment or coating a substrate using plasma enhanced chemical vapor deposition under atmospheric or near atmospheric pressure conditions, the electrode having a body defining a cavity therein, the body having at least one inlet passageway there through in gaseous communication with the cavity so that a gas mixture can be flowed into the cavity by way of the at least one inlet passageway, the electrode having at least one outlet passageway there through in gaseous communication with the cavity so that a gas that is flowed into the cavity can flow out of the cavity by way of the at least one outlet passageway, the at least one outlet passageway being a slot. The improvement is to position a porous body in the cavity sealed to the wall of the cavity adjacent to the outlet passageway so that a gas that is flowed into the cavity will pass through the porous body before flowing through the outlet passageway.

Claims

1. An improved electrode useful for modifying a substrate using corona discharge, dielectric barrier discharge or glow discharge plasma treatment or coating a substrate using plasma enhanced chemical vapor deposition under atmospheric or near atmospheric pressure conditions, the electrode comprising a body defining a cavity therein, the body having at least one inlet passageway therethrough in gaseous communication with the cavity so that a gas mixture can be flowed into the cavity by way of the at least one inlet passageway, the electrode having at least one outlet passageway therethrough in gaseous communication with the cavity so that a gas that is flowed into the cavity can flow out of the cavity by way of the at least one outlet passageway, the at least one outlet passageway being a slot, wherein the improvement comprises a porous body positioned in and sealed to the wall of the cavity adjacent to the outlet passageway so that a gas that is flowed into the cavity will pass through the porous body before flowing through the outlet passageway, wherein the porous body is comprised of sintered granules of a solid material that is a glass material or metal material.

2. The improved electrode of claim 1, wherein the porous body is comprised of sintered granules of a metal material.

3. The improved electrode of any one of claim 1, wherein the permeability of the porous body is in the range of from 3×

10⁶ m² to 3×

10¹⁰ m².

4. The improved electrode of any one of claim 1, wherein the permeability of the porous body is in the range of from 3×

10⁷ m² to 3×

10⁹ m².

5. The improved electrode of any one of claim 1, wherein the permeability of the porous body is in the range of from 1×

10⁸ m² to 6×

10⁸ m².

6. A process of coating a substrate using plasma enhanced chemical vapor deposition under atmospheric or near atmospheric pressure conditions, the process comprising steps of:

providing the improved electrode of claim 1; and

flowing a gas mixture into the cavity by way of the at least one inlet passageway, through the porous body, and out of the cavity by way of the slot and into an atmospheric pressure or near atmospheric pressure plasma that is in a spacing between the improved electrode and a substrate positioned on a counter electrode to form a plasma enhanced chemical vapor deposition coating on the substrate.