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Micromechanical sensor element, method for manufacturing a micromechanical sensor element and method for operating a micromechanical sensor element

  • US 20100011860A1
  • Filed: 07/09/2009
  • Published: 01/21/2010
  • Est. Priority Date: 07/18/2008
  • Status: Active Grant
First Claim
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1. A micromechanical sensor element, comprising:

  • a substrate;

    a first seismic mass suspended from the substrate, wherein the first seismic mass is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension of the first seismic mass; and

    a second seismic mass deflectable by the acceleration from a second rest position;

    wherein at least a partial overlap between the first seismic mass and the second seismic mass is provided perpendicular to the main plane of extension.

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