PRINTED WIRING BOARD HAVING RECOGNITION MARK

• US 20100012356A1
• Filed: 05/12/2009
• Published: 01/21/2010
• Est. Priority Date: 07/17/2008
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hasegawa, Kenji
• Application Number:
  US12/464,441
• Publication Number:
  US 20100012356A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/2072 Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 3/0008 for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3452 Solder masks

Abstract

According to one embodiment, a printed wiring board comprises an insulating substrate having a mounting surface, a recognition mark formed on the mounting surface of the insulating substrate, and a plurality of reinforcing patterns formed on the mounting surface of the insulating substrate. The reinforcing patterns extend from an outer periphery of the recognition mark toward outside of the recognition mark and are arranged circumferentially at intervals relative to the recognition mark. Each of the reinforcing patterns has a width less than a width of a part of the outer periphery of the recognition mark connecting adjacent ones of the reinforcing patterns.

Claims

1. A printed wiring board comprising:

an insulating substrate comprising a mounting surface;

a fiduciary marker on the mounting surface of the insulating substrate; and

a plurality of reinforcing patterns on the mounting surface of the insulating substrate, the reinforcing patterns extending from an outer periphery of the fiduciary marker toward outside of the fiduciary marker and located circumferentially at intervals relative to the fiduciary marker, wherein each of the reinforcing patterns has a width shorter than a length of a portion of the outer periphery of the fiduciary marker connecting to adjacent reinforcing patterns.

2. The printed wiring board of claim 1, wherein the fiduciary marker and the reinforcing patterns are attached to the mounting surface.

3. The printed wiring board of claim 2, further comprising a resist film on the mounting surface of the insulating substrate and over at least a portion of the reinforcing patterns, the resist film comprising an opening portion comprising the fiduciary marker.

4. The printed wiring board of claim 3, wherein the resist film comprises an edge portion which is the opening portion, the edge portion surrounding the fiduciary marker in a position apart from the fiduciary marker.

5. The printed wiring board of claim 3, wherein the edge portion of the resist film is configured to cover the reinforcing patterns.

6. The printed wiring board of claim 1, wherein the reinforcing patterns radially extend from the fiduciary marker.

7. The printed wiring board of claim 6, wherein the fiduciary marker and the reinforcing patterns comprise a conductive material.

8. The printed wiring board of claim 7, further comprising a conductive layer on a mounting surface of the insulating substrate, the conductive layer being apart from the fiduciary marker on the mounting surface and electrically connected to the fiduciary marker via the reinforcing patterns.

9. A printed wiring board comprising:

an insulating substrate comprising a mounting surface;

a conductive layer on the mounting surface of the insulating substrate;

a fiduciary marker on the mounting surface of the insulating substrate, the fiduciary marker comprising conductivity and being separated from the conductive layer; and

a plurality of conductive patterns on the mounting surface of the insulating substrate, the conductive patterns extending from an outer periphery of the fiduciary marker toward outside of the fiduciary marker, being located circumferentially at intervals relative to the fiduciary marker, and configured to connect the fiduciary marker and the conductive layer, each of the conductive patterns comprising a width shorter than a length of a portion of the outer periphery of the fiduciary marker connecting adjacent conductive patterns.

10. The printed wiring board of claim 9, wherein the fiduciary marker and the conductive patterns are attached to the mounting surface.

11. The printed wiring board of claim 9, further comprising a resist film on the mounting surface of the insulating substrate, and over at least a portion of the conductive patterns.

12. The printed wiring board of claim 11, wherein connecting portions between the conductive layer and the conductive patterns are under the resist film.

13. The printed wiring board of claim 11, wherein at least a portion of the conductive layer is a test pad exposed to outside of the resist film without being under the resist film.

14. A printed wiring board comprising:

an insulating substrate comprising a first mounting surface, a second mounting surface opposite to the first mounting surface, a first conductive through hole in the first mounting surface and the second mounting surface, and a second conductive through hole in the first mounting surface and the second mounting surface in a position apart from the first conductive through hole;

a fiduciary marker on the first mounting surface of the insulating substrate and comprising conductivity;

a plurality of reinforcing patterns on the first mounting surface of the insulating substrate comprising conductivity, the reinforcing patterns extending from an outer periphery of the fiduciary marker toward outside of the fiduciary marker and being located circumferentially at intervals relative to the fiduciary marker, the reinforcing patterns comprising a width shorter than an outer periphery of the fiduciary marker configured to connect to adjacent reinforcing patterns, one of the adjacent reinforcing patterns configured to electrically connect to the first conductive through hole;

a first conductive layer on the first mounting surface of the insulating substrate, the first conductive layer being away from the fiduciary marker and configured to electrically connect to the second conductive through hole; and

a second conductive layer on the second mounting surface of the insulating substrate, the second conductive layer is configured to electrically connect the first conductive through hole to the second conductive through hole.

15. The printed wiring board of claim 14, wherein a reinforcing pattern in the reinforcing patterns and corresponding to the first conductive through hole comprises a land configured to electrically connect to the first conductive through hole.

16. The printed wiring board of claim 14, wherein the second conductive layer comprises lands configured to electrically connect to the first conductive through hole and the second conductive through hole.