Light emitting element and method of making the same
First Claim
1. A light emitting element, comprising:
- a first electrode;
a second electrode formed on a same side as the first electrode and comprising an area less than the first electrode;
a first bump formed on the first electrode; and
a second bump formed on the second electrode and comprising a level at a top thereof higher than that of the first bump.
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Accused Products
Abstract
A light emitting element includes a first electrode, a second electrode formed on a same side as the first electrode and including an area less than the first electrode, a first bump formed on the first electrode, and a second bump formed on the second electrode and including a level at a top thereof higher than that of the first bump. A flip-chip type light emitting element includes a spreading electrode, the spreading electrode including an extended part, and plural intermediate electrodes formed on the spreading electrode and arranged in a longitudinal direction of the extended part and centrally in a width direction of the extended part. The intermediate electrodes are disposed such that a distance of half a pitch thereof in the longitudinal direction is equal to or shorter than a distance from one of the intermediate electrodes to an edge of the extended part.
28 Citations
8 Claims
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1. A light emitting element, comprising:
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a first electrode; a second electrode formed on a same side as the first electrode and comprising an area less than the first electrode; a first bump formed on the first electrode; and a second bump formed on the second electrode and comprising a level at a top thereof higher than that of the first bump. - View Dependent Claims (2, 3)
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4. A method of making a light emitting element, comprising:
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growing, on a growth substrate, group III nitride semiconductor layers including an n-type contact layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer and a p-type contact layer; removing a part of the p-type contact layer, the p-type cladding layer, the light-emitting layer, and the n-type cladding layer to expose the n-type contact layer; forming a p-side electrode on the p-type contact layer; forming an n-side electrode on the n-type contact layer, the n-side electrode comprising an area less than that of the p-side electrode; forming a p-side bump on the p-side electrode; and forming an n-side bump on the n-side electrode, the n-side bump comprising a level at a top thereof higher than that of the p-side bump. - View Dependent Claims (5)
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6. A flip-chip type light emitting element, comprising:
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a spreading electrode for feeding current to a light-emitting layer, the spreading electrode comprising an extended part extending in a predetermined direction; a plurality of intermediate electrodes formed on the spreading electrode and arranged in a longitudinal direction of the extended part and centrally in a width direction of the extended part; an insulating layer formed on the spreading electrode; and a joining electrode formed on the insulating layer for feeding current through the plurality of intermediate electrodes to the spreading electrode, wherein the plurality of intermediate electrodes are disposed such that a distance of half a pitch thereof in the longitudinal direction is equal to or shorter than a distance from one of the plurality of intermediate electrodes to an edge of the extended part. - View Dependent Claims (7, 8)
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Specification