IN-MOLDED CAPACITIVE SENSORS
First Claim
1. A method for forming an in-molded capacitive sensing device, said method comprising:
- providing a plastic film comprising a first side and a second side;
disposing a capacitive sensor pattern on at least a portion of said second side, said capacitive sensor pattern including a region for facilitating electrical contact;
printing a resin layer over a portion of said capacitive sensor pattern such that access to said region for facilitating electrical contact is maintained; and
injection molding a plastic layer onto a portion of said resin layer such that said capacitive sensor pattern becomes in-molded between said plastic film and said plastic layer while access to said region for facilitating electrical contact is maintained.
3 Assignments
0 Petitions
Accused Products
Abstract
In a method for forming an in-molded capacitive sensing device a plastic film is provided, the plastic film comprising a first side and a second side. A capacitive sensor pattern is disposed on at least a portion of the second side, the capacitive sensor pattern including a region for facilitating electrical contact. A resin layer is printed over a portion of the capacitive sensor pattern such that access to the region for facilitating electrical contact is maintained. A plastic layer is injection molded onto a portion of the resin layer such that the capacitive sensor pattern becomes in-molded between the plastic film and the plastic layer while access to the region for facilitating electrical contact is maintained.
-
Citations
20 Claims
-
1. A method for forming an in-molded capacitive sensing device, said method comprising:
-
providing a plastic film comprising a first side and a second side; disposing a capacitive sensor pattern on at least a portion of said second side, said capacitive sensor pattern including a region for facilitating electrical contact; printing a resin layer over a portion of said capacitive sensor pattern such that access to said region for facilitating electrical contact is maintained; and injection molding a plastic layer onto a portion of said resin layer such that said capacitive sensor pattern becomes in-molded between said plastic film and said plastic layer while access to said region for facilitating electrical contact is maintained. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A plastic embedded capacitive sensor comprising:
-
a plastic film comprising a first side and a second side; an injection molded plastic layer; and a capacitive sensor pattern embedded between said second side and said injection molded plastic layer such that access to a region of said capacitive sensor pattern is maintained for facilitating electrical contact with said capacitive sensor pattern. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A process for creating a plastic embedded capacitive sensor, said process comprising:
-
providing a plastic film comprising a first side and a second side; providing a capacitive sensor pattern; providing an injection molded plastic layer such that said capacitive sensor pattern is embedded between said second side and said injection molded plastic layer; and providing electrical coupling access to a region of said capacitive sensor pattern such that an electrical coupling with said capacitive sensor pattern is facilitated. - View Dependent Claims (20)
-
Specification