HEAT DISSIPATION APPARATUS

• US 20100014243A1
• Filed: 09/12/2008
• Published: 01/21/2010
• Est. Priority Date: 07/21/2008
• Status: Active Grant

• Current Assignee: Cloud Network Technology Singapore Pte. Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: TSAI, LUNG-SHENG, CHEN, LI-PING
• Granted Patent: US 7,755,903 B2
• Time in Patent Office: Days
• US Class Current: 361/679.470
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipating apparatus includes a base, a heat sink received in the base, and a retaining cover attached to the base. The retaining cover defines two crossing slots for cooperatively forming at least one flap. Each free portion of flap has a free portion. The free portion of each flap elastically curves towards the heat sink to bias the heat sink towards the base.

Claims

1. A heat dissipating apparatus comprising:

a base;

a heat sink received in the base, and

a retaining cover attached to the base, the retaining cover defining two crossing slots for cooperatively forming at least one flap, each flap has a free portion, the free portion of each flap elastically curving towards the heat sink to bias the heat sink towards the base.

2. The heat dissipating apparatus of claim 1, wherein the retaining cover is pivotally attached to the base.

3. The heat dissipating apparatus of claim 2, wherein the retaining cover includes a latching member pivotally attached thereon, a retaining notch is defined in the latching member;

a post protrudes from the base for engaging with the retaining notch.

4. The heat dissipating apparatus of claim 3, wherein a width of the notch decreases from an out side edge to where the retaining notch engages with the post.

5. The heat dissipating apparatus of claim 3, wherein the pivot point of the retaining cover and the base is positioned on an edge of the cover opposite to the latching member.

6. The heat dissipating apparatus of claim 1, wherein the retaining cover is partially depressed at a crossing portion of the slots due to the curve of the at least one flap.

7. The heat dissipating apparatus of claim 1, wherein the slots are perpendicular to each other, and the at least one flap comprises four corner-shaped flaps in four quadrants.

8. A heat dissipating assembly comprising:

a motherboard;

a heat generating element arranged on the motherboard;

a base fixed on the motherboard;

a heat sink received in the base, the heat sink configured for contacting the heat generating element; and

a retaining cover attached to the base, at least one inner flap formed on the retaining cover, each flap having a free portion, the free portion of each flap urging the heat sink in contact with the heat generating element.

9. The heat dissipating assembly of claim 8, wherein the retaining cover is pivotally attached to the base.

10. The heat dissipating assembly of claim 9, wherein the retaining cover includes a latching member pivotally attached thereto, a retaining notch is defined in the latching member;

a post protrudes from the base for corresponding with the retaining notch.

11. The heat dissipating assembly of claim 10, wherein a width of the retaining notch decreases from an outer edge to where the retaining notch engages with the post.

12. The heat dissipating assembly of claim 10, wherein the pivot point of the retaining cover and the base is positioned on an edge of the retaining cover opposite to the latching member.

13. The heat dissipating assembly of claim 8, wherein the retaining cover defines two crossing slots, and the at least one flap is formed by defining of the slots.

14. The heat dissipating assembly of claim 13, wherein the free portions are curved to elastically abut the heat sink, and the retaining cover is partially depressed at an crossing portion of the slots due to the curve of the free portion.

15. The heat dissipating assembly of claim 13, wherein the slots are perpendicular to each other, and the at least one flap comprises four corner-shaped flaps in four quadrants.