Audio headphone provided with device to prevent audio feedback

• US 20100014684A1
• Filed: 07/15/2008
• Published: 01/21/2010
• Est. Priority Date: 07/15/2008
• Status: Active Grant

• Current Assignee: Jinsuan Chen
• Original Assignee: Jinsuan Chen
• Inventors: Chen, Jinsuan
• Granted Patent: US 8,045,742 B2
• Time in Patent Office: Days
• US Class Current: 381/71.600
• CPC Class Codes: H04R 1/1091 Details not provided for in groups H04R1/1008 - H04R1/1083

Abstract

An ear muff used with a headset containing two ear muffs. Both of the ear muffs are provided with a loudspeaker and a microphone for sensing ambient noise. An active noise reduction (ANR) circuitry is utilized to cancel the ambient noise. An immobile or inflexible disc is provided within each ear muff for preventing the change of dimensions of an enclosure which includes the loudspeaker and microphone, thereby preventing audio feedback.

Claims

1. A headphone including an ear muff provided with an active noise reduction circuit, the ear muff, comprising:

a support structure having a microphone and loudspeaker attached thereto;

a housing structure having a first side and a second side, said first side facing said support structure at a finite distance from said support structure to produce an enclosure between said support structure and said housing structure, said loudspeaker and said microphone provided within said enclosure;

an inflexible disc facing said second side of said housing; and

a cushion enclosing said support structure, said housing structure and said flexible disc;

wherein when pressure is applied to said cushion, the distance between said support structure and said housing structure does not change due to the inclusion of said inflexible disc, thereby preventing audio feedback.

2. The headphone in conjunction with claim 1, further including at least one spacer provided between said support structure and said housing structure used to separate said support structure from said housing structure.

3. The headphone in conjunction with claim 1, wherein said at least one spacer is attached to said support structure.

4. The headphone in accordance with claim 1, further including an ear muff skin covering said cushion.

5. The headphone in accordance with claim 4, wherein said ear muff skin provided with a plurality of holes allowing ambient noise to enter the ear muff.

6. The headphone in accordance with claim 5, wherein said cushion is provided with a first opening aligned with said plurality of holes.

7. The headphone in accordance with claim 6, wherein said housing structure is provided with a second opening aligned with said first opening and said plurality of holes allowing ambient noise to travel through the ear muff and enter said enclosure.

8. The headphone in accordance with claim 1, wherein an adhesive member is provided between said support structure and said housing structure.

9. The headphone in accordance with claim 1, wherein said first opening is covered by a non-woven cloth.

10. The headphone in accordance with claim 1, wherein said inflexible disc is constructed from a plastic material.

11. The headphone in accordance with claim 1, wherein said inflexible disc is constructed from a metallic material.

12. The headphone in accordance with claim 1, wherein said inflexible disc is constructed from a wooden material.

13. The headphone in accordance with claim 1, wherein said disc has a hemispherical shape.

14. The headphone in accordance with claim 10, wherein said disc has a hemispherical shape.

15. The headphone in accordance with claim 11, wherein said disc has a hemispherical shape.

16. The headphone in accordance with claim 12, wherein said disc has a hemispherical shape.

17. The headphone in accordance with claim 1, wherein the distance between said support structure and said housing structure is at least 2 mm.