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METHODS TO PROMOTE ADHESION BETWEEN BARRIER LAYER AND POROUS LOW-K FILM DEPOSITED FROM MULTIPLE LIQUID PRECURSORS

  • US 20100015816A1
  • Filed: 07/15/2008
  • Published: 01/21/2010
  • Est. Priority Date: 07/15/2008
  • Status: Abandoned Application
First Claim
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1. A method of processing a substrate, comprising:

  • positioning the substrate on a support in a processing chamber;

    providing a first organosilicon precursor to the chamber at a first flow rate;

    providing a second organosilicon precursor comprising to the chamber at a second flow rate;

    providing a hydrocarbon mixture to the chamber at a third flow rate;

    providing an oxidizing agent to the chamber at a fourth flow rate;

    ramping the second flow rate of the second organosilicon precursor to a higher flow rate;

    ramping the flow rate of the oxidizing agent to a higher flow rate; and

    diverting the hydrocarbon mixture to bypass the chamber for at least part of the time the substrate is being processed.

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