GAMMA AND TEMPERATURE HARDENED PHARMACEUTICAL DEVICES
First Claim
1. A method of creating a sterile component, having embedded electronics, comprising:
- manufacturing an electronic device using Silicon on Insulator (SOI) technology;
affixing said electronic device to said component; and
sterilizing said component by subjecting said component to gamma or beta radiation.
3 Assignments
0 Petitions
Accused Products
Abstract
A system and method for implementing embedded electronics in environments where radiation or extreme temperatures are used is disclosed. Embedded electronics are affixed to various components of a pharmaceutical system, thereby enabling the customer to download pertinent information about the component, such as lot number, date of manufacturer, test parameters, etc. Additionally, these electronics allow an array of functions and features to be implemented, such as integrity tests and diagnostics. The electronics in the pharmaceutical components utilize a technology that is not as susceptible to radiation and extreme temperatures as traditional electronics.
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Citations
27 Claims
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1. A method of creating a sterile component, having embedded electronics, comprising:
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manufacturing an electronic device using Silicon on Insulator (SOI) technology; affixing said electronic device to said component; and sterilizing said component by subjecting said component to gamma or beta radiation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of creating a sterile component for pharmaceutical or medical use having embedded electronics, comprising:
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manufacturing an electronic device using Silicon on Insulator (SOI) technology; affixing said electronic device to said component; and
sterilizing said component by subjecting said component to high temperature steam sterilization. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. The method of verifying the temperature profile of a pharmaceutical or medical product as it is being brought to its desired storage temperature, comprising:
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a. Affixing a temperature sensor to a container or carrier for said product, wherein said temperature sensor is constructed from electronic devices manufactured using SOI technology; b. Placing said product into a temperature chamber adapted to bring said product to said desired storage temperature; c. Using said temperature sensor to record a plurality of temperature measurements as said product is brought to said desired temperature; and d. Comparing said plurality of temperature measurements to an acceptable temperature profile. - View Dependent Claims (24, 25, 26, 27)
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Specification