SURFACE MOUNT PACKAGE

• US 20100018047A1
• Filed: 09/25/2009
• Published: 01/28/2010
• Est. Priority Date: 05/24/2005
• Status: Abandoned Application

• Current Assignee: William Palmteer
• Original Assignee: William Palmteer
• Inventors: Palmteer, William
• Application Number:
  US12/566,744
• Publication Number:
  US 20100018047A1
• Time in Patent Office: Days
• US Class Current: 29/829
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.

Claims

1. A method for manufacturing a surface mount package, the method comprising:

providing a first metal layer;

providing a second metal layer electrically connected to the first metal layer; and

providing a ceramic layer between the first and second metal layers, the ceramic layer having an opening therethrough and configured to electrically isolate a positive side from a negative side of the surface mount package.

2. The method according to claim 1, further comprising:

forming a gap within the first metal layer to electrically isolate the positive side from the negative side.

3. The method according to claim 1, further comprising:

providing an opening in both the second metal layer and ceramic layer configured to receive a surface mount device for mounting to the surface mount package.