Vapor Chamber with Boiling-Enhanced Multi-Wick Structure

• US 20100018678A1
• Filed: 09/29/2009
• Published: 01/28/2010
• Est. Priority Date: 12/01/2004
• Status: Abandoned Application

• Current Assignee: Convergence Technologies (USA) LLC
• Original Assignee: Convergence Technologies (USA) LLC
• Inventors: Siu, Wing Ming
• Application Number:
  US12/569,406
• Publication Number:
  US 20100018678A1
• Time in Patent Office: Days
• US Class Current: 165/104.260
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.

Claims

1. A heat transfer device, comprising:

at least one chamber containing a condensable fluid, the at least one chamber including an evaporation region configured to be coupled to a heat source for vaporizing the condensable fluid, the vaporized condensable fluid collecting as condensate on surfaces within the at least one chamber; and

a boiling-enhanced multi-wick structure comprising a plurality of interoperable wick structures disposed within the at least one chamber for facilitating flow of the condensate toward the evaporation region and reducing an associated boiling superheat.

2. The heat transfer device of claim 1, wherein the at least one chamber includes a condensation site, and wherein the boiling-enhanced multi-wick structure includes a wick at the condensation site and a boiling-enhanced wick at the evaporation region that has a higher wicking power factor than the wick at the condensation site.

3. The heat transfer device of claim 2, wherein the boiling-enhanced wick at the evaporation region includes at least one of:

fins, pins, interlinking structures between fins, interlinking structures between pins, foam, and porous structure.

4. The heat transfer device of claim 3, wherein the porous structure includes mesh.

5. The heat transfer device of claim 1, where at least part of the boiling-enhanced multi-wick structure comprises a multi-layer structure comprising at least one of:

a plate, a mesh, at least one groove in a surface of the at least one chamber, a sintered layer, and a porous layer.

6. The heat transfer device of claim 1, wherein the boiling-enhanced multi-wick structure has a spatially varying wick structure that varies in accordance with the condensate'"'"'s spatial flow requirements as the condensate travels toward the evaporation region.

7. The heat transfer device of claim 6, wherein the boiling-enhanced multi-wick structure includes at least one of:

at least one fin, at least one pin, a plate, a mesh, a groove in a surface of at least one chamber, a powder wick, and a foam wick.

8. The heat transfer device of claim 6, wherein the spatially varying wick structure includes a spatially varying quantity of wicking structure.

9. The heat transfer device of claim 1, wherein the boiling-enhanced multi-wick structure includes at least one bridging wick structure interoperably connecting portions of the boiling-enhanced multi-wick structure to facilitate flow of the condensate between the portions of the boiling-enhanced multi-wick structure.

10. The heat transfer device of claim 9, wherein the bridging wick structure comprises at least one of:

fins, pins, interlinking structures between fins, interlinking structures between pins, foam, mesh, and porous structure; and

wherein a proximity of at least a portion of the bridging wick structure to at least a part of the condensation surface enables the functional return of condensate.

11. The heat transfer device of claim 9, wherein the bridging wick structure comprises an internal support structure for the at least one chamber.

12. The heat transfer device of claim 1, wherein the boiling-enhanced multi-wick structure includes a wick structure with varying porosity.

13. The heat transfer device of claim 1, wherein some part of at least one chamber is in functional contact with at least one fin.

14. The heat transfer device of claim 13, wherein the at least one fin includes at least one opening through which air can flow.

15. The heat transfer device of claim 1, wherein at least one chamber includes a base chamber and a fin chamber.

16. The heat transfer device of claim 15, wherein at least one fin is in functional contact with the fin chamber.

17. The heat transfer device of claim 1, wherein the at least one chamber has a substantially clip configuration.

18. The heat transfer device of claim 1, wherein the at least one chamber forms a part of a casing enclosure.

19. The heat transfer device of claim 1, wherein the at least one chamber forms a part of a cabinet enclosure.

20. The heat transfer device of claim 1, wherein the at least one chamber is in functional contact with a cooling liquid.

21. The heat transfer device of claim 1, wherein part of the at least one chamber is constructed out of at least one of:

metal, plastic, metal coated plastic, graphite, diamond and carbon-nanotubes.

22. The heat transfer device of claim 1, wherein the at least one chamber includes an internal support structure to prevent collapse of the at least one chamber.

23. A method for transferring heat from a heat source, the method comprising:

receiving heat in a heat device from the heat source, the heat device comprising at least one chamber containing a condensable fluid, the at least one chamber including an evaporation region configured to be coupled to the heat source; and

a boiling-enhanced multi-wick structure comprising a plurality of interoperable wick structures disposed within the at least one chamber for facilitating flow of the condensate toward the evaporation region and reducing an associated boiling superheat; and

vaporizing the condensable fluid in the at least one chamber, the vaporized condensable fluid collecting as condensate on surfaces within the at least one chamber.