PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME

• US 20100019393A1
• Filed: 08/25/2008
• Published: 01/28/2010
• Est. Priority Date: 07/23/2008
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: HSIEH, Yu-Sheng, LIN, Jing-Yuan
• Application Number:
  US12/197,519
• Publication Number:
  US 20100019393A1
• Time in Patent Office: Days
• US Class Current: 257/777
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A packaging structure for integration of microelectronics and MEMS devices by 3D stacking is disclosed, which comprises: an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least a through hole is formed on the ASIC unit; and a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate; wherein the micro sensor is disposed in the cavity and there is a conductive material filling the through hole so that the ASIC unit and the MEMS unit can be electrically connected to each other when the ASIC unit is attached onto the MEMS unit.

Claims

1. A packaging structure for integration of microelectronics and MEMS devices by 3D stacking, the packaging structure comprising:

an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least a through hole is formed on the ASIC unit; and

a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate;

wherein the micro sensor is disposed in the cavity and there is a conductive material filling the through hole so that the ASIC unit and the MEMS unit are electrically connected to each other when the ASIC unit is attached onto the MEMS unit.

2. The packaging structure as recited in claim 1, wherein the cavity comprises a conductive portion therein, the conductive portion being electrically connected to the through hole and the MEMS unit, respectively.

3. The packaging structure as recited in claim 1, wherein the through hole is electrically connected to the circuit layout on the surface of the first substrate.

4. The packaging structure as recited in claim 1, wherein the conductive material is a metal material.

5. The packaging structure as recited in claim 1, further comprising a plurality of ASIC units stacked on the circuit layout being electrically connected thereto.

6. A packaging structure for integration of microelectronics and MEMS devices by 3D stacking, the packaging structure comprising:

an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least two through holes are formed on the ASIC unit; and

a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate;

wherein the micro sensor is disposed in the cavity and there is a conductive material filling at least one of the through holes so that the ASIC unit and the MEMS unit are electrically connected to each other when the ASIC unit is attached onto the MEMS unit.

7. The packaging structure as recited in claim 6, wherein the cavity comprises a conductive portion therein, the conductive portion being electrically connected to at least one of the through holes and the MEMS unit, respectively.

8. The packaging structure as recited in claim 6, wherein at least one of the through holes is electrically connected to the circuit layout on the surface of the first substrate.

9. The packaging structure as recited in claim 6, wherein the conductive material is a metal material.

10. The packaging structure as recited in claim 6, further comprising a plurality of ASIC units stacked on the circuit layout being electrically connected thereto.

11. A method for manufacturing a packaging structure for integration of microelectronics and MEMS devices by 3D stacking, the method comprising steps of:

(a) providing an ASIC unit and a MEMS unit, the ASIC unit comprising a first substrate and a circuit layout formed on a surface of the first substrate and the MEMS unit comprising a second substrate and a micro sensor disposed on the second substrate;

(b) performing a thinning process on the other surface of the first substrate;

(c) forming a cavity on the other surface of the first substrate, wherein the micro sensor is disposed in the cavity;

(d) providing a conductive portion in the cavity, the conductive portion being electrically connected to the MEMS unit;

(e) stacking the ASIC unit and MEMS unit so that the micro sensor is disposed in the cavity;

(f) forming at least a through hole so that the through hole is electrically connected to the circuit layout and the conductive portion, respectively; and

(g) filling the through hole with a conductive material so that the circuit layout and the conductive portion are electrically connected.

12. The packaging structure as recited in claim 11, wherein the conductive material is a metal material.