SPACER FOR MEMS DEVICE

• US 20100020382A1
• Filed: 07/22/2008
• Published: 01/28/2010
• Est. Priority Date: 07/22/2008
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Lin, Yen Hua, Su, Yi Fan, Pao, Feng Ming, Wu, Cheng Wei
• Application Number:
  US12/177,816
• Publication Number:
  US 20100020382A1
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

An improved spacer in an apparatus comprising a MEMS device that is packaged between a substrate and cover plate, where the improved spacer protects traces running on the substrate and under the spacer. The improved spacer reduces the amount of force or pressure on the traces or wires, which reduces line out damage when an array of packaged MEMS devices are separated by pressure or force into one packaged MEMS device. In one embodiment, the improved spacer comprises a softer, deformable, elastic, or malleable material that does not crush the traces. This softer material can be an elastic polymeric spacer. In another embodiment, the improved spacer can protect these traces by having a shape with a smaller contact surface which minimizes the amount of traces being affected. This surface can be a sphere or a ball.

Claims

1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:

providing a transparent substrate comprising at least one MEMS device formed thereon;

providing a cover plate; and

sealing said transparent substrate to said cover plate with a sealant, wherein said sealant comprises a polymeric spacer material.

2. The method of claim 1, wherein the polymeric spacer material is spherical.

3. The method of claim 2, wherein the polymeric spacer material is between 5 and 50 microns in diameter.

4. The method of claim 2, wherein the polymeric spacer material is about 12 microns in diameter.

5. The method of claim 1, wherein the polymeric spacer material is elastically deformable.

6. The method of claim 1, wherein said sealant comprises between 0.1% and 10% polymeric spacer material.

7. The method of claim 1, wherein said sealant comprises 0.5% polymeric spacer material.

8. The method of claim 1, wherein said MEMS device is an interferometric modulator device.

9. The method of claim 1, wherein the method takes place in ambient conditions.

10. A microelectromechanical systems (MEMS) based device, comprising:

a transparent substrate comprising at least one MEMS device formed thereon; and

a cover plate sealed to said transparent substrate with a sealant, wherein said sealant comprises a polymeric spacer.

11. The device of claim 10, wherein the polymeric spacer comprises an elastically deformable material.

12. The device of claim 10, wherein the polymeric spacer comprises a spherical material.

13. The device of claim 12, wherein an end of the polymeric spacer facing the substrate comprises a circular ball shape.

14. The device of claim 10, further comprising:

a display;

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

15. The device of claim 14, further comprising a driver circuit configured to send at least one signal to the display.

16. The device of claim 15, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

17. The device of claim 14, further comprising an image source module configured to send the image data to the processor.

18. The device of claim 17, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The device of claim 14, further comprising an input device configured to receive input data and to communicate the input data to the processor.

20. A microelectromechanical systems (MEMS) based device, comprising:

a transparent substrate comprising at least one MEMS device formed thereon; and

a cover plate covering said transparent substrate; and

means for sealing said transparent substrate to said cover plate, wherein said sealing means comprises a polymeric spacer material.

21. The device of claim 20, wherein the polymeric spacer material is spherical.

22. The device of claim 20, wherein the polymeric spacer material is elastically deformable.

23. The device of claim 20, wherein the substrate comprises a plurality of MEMS devices formed thereon.

24. The device of claim 23, wherein the MEMS devices comprise an interferometric modulator array or device.

25. The device of claim 20, wherein the substrate and cover plate are at least 2,850 mm×

3,050 mm in size.