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RF shielding arrangement for semiconductor packages

  • US 20100020518A1
  • Filed: 07/28/2008
  • Published: 01/28/2010
  • Est. Priority Date: 07/28/2008
  • Status: Abandoned Application
First Claim
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1. A method for packaging a semiconductor module, the semiconductor module comprising a substrate, and a plurality of circuit components, the plurality of circuit components being formed on the substrate, the method comprising the steps of:

  • creating at least one via on the saw street region of the substrate;

    transfer molding a first surface of the substrate with a molding compound;

    partially singulating the transfer molded substrate from the first surface of the substrate to create a kerf on the saw street region, wherein the singulation is performed through the molding compound and the at least one via;

    plating the transfer molded substrate with a shielding material, wherein a ground pad of the substrate is connected to the shielding material through the at least one via; and

    singulating the substrate from a second surface, the second surface being opposite to the first surface.

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