RF shielding arrangement for semiconductor packages
First Claim
1. A method for packaging a semiconductor module, the semiconductor module comprising a substrate, and a plurality of circuit components, the plurality of circuit components being formed on the substrate, the method comprising the steps of:
- creating at least one via on the saw street region of the substrate;
transfer molding a first surface of the substrate with a molding compound;
partially singulating the transfer molded substrate from the first surface of the substrate to create a kerf on the saw street region, wherein the singulation is performed through the molding compound and the at least one via;
plating the transfer molded substrate with a shielding material, wherein a ground pad of the substrate is connected to the shielding material through the at least one via; and
singulating the substrate from a second surface, the second surface being opposite to the first surface.
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Accused Products
Abstract
A packaging for semiconductor modules such as multi chip modules (MCM). At least one via is created on saw street region of a substrate having circuit components. The substrate is transfer molded and the transfer molded substrate is partially singulated from a first surface along with the via to create a groove. The partially singulated substrate including the groove on the saw street region and the via is coated or plated with a conducting material for RF shielding. Accordingly, the conducting material and a ground terminal of the substrate are connected through the via on the substrate.
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Citations
13 Claims
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1. A method for packaging a semiconductor module, the semiconductor module comprising a substrate, and a plurality of circuit components, the plurality of circuit components being formed on the substrate, the method comprising the steps of:
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creating at least one via on the saw street region of the substrate; transfer molding a first surface of the substrate with a molding compound; partially singulating the transfer molded substrate from the first surface of the substrate to create a kerf on the saw street region, wherein the singulation is performed through the molding compound and the at least one via; plating the transfer molded substrate with a shielding material, wherein a ground pad of the substrate is connected to the shielding material through the at least one via; and singulating the substrate from a second surface, the second surface being opposite to the first surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A packaging arrangement for a printed circuit board having a plurality of semiconductor components mounted thereon, comprising:
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a substrate, the substrate mounting the plurality of semiconductor components; a ground pad on the lower surface of the substrate; at least one via on the substrate, the via comprising conductive means connected to the ground pad; a non conductive molding compound surrounding the plurality of semiconductor components; and a conductive material deposited on said molding compound to from an RF shield, the conductive material being electrically connected to the at least one via and thereby to the ground pad. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification