IC HAVING AN RF BUS STRUCTURE
First Claim
Patent Images
1. An integrated circuit (IC) comprises:
- a plurality of circuit modules on a die;
a package substrate supporting the die, wherein the package substrate includes a micro-electromechanical (MEM) area;
a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes;
a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data;
a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal;
a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream;
a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section;
an impedance matching circuit coupled to the single-ended winding; and
a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area.
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Abstract
An integrated circuit (IC) includes a die and a package substrate. The die includes circuit modules and an RF bus transceiver module and the package substrate includes a micro-electromechanical (MEM) area. The RF bus transceiver module includes a baseband processing module, a transmitter section, a receiver section, a transformer, an impedance matching circuit, and a transmission line. At least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area.
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Citations
12 Claims
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1. An integrated circuit (IC) comprises:
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a plurality of circuit modules on a die; a package substrate supporting the die, wherein the package substrate includes a micro-electromechanical (MEM) area; a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes; a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data; a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal; a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream; a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section; an impedance matching circuit coupled to the single-ended winding; and a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated circuit (IC) comprises:
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a plurality of circuit modules on a die, wherein the die includes a micro-electromechanical (MEM) area; a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes; a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data; a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal; a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream; a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section; an impedance matching circuit coupled to the single-ended winding; and a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification