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IC HAVING AN RF BUS STRUCTURE

  • US 20100022195A1
  • Filed: 10/05/2009
  • Published: 01/28/2010
  • Est. Priority Date: 01/31/2007
  • Status: Active Grant
First Claim
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1. An integrated circuit (IC) comprises:

  • a plurality of circuit modules on a die;

    a package substrate supporting the die, wherein the package substrate includes a micro-electromechanical (MEM) area;

    a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes;

    a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data;

    a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal;

    a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream;

    a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section;

    an impedance matching circuit coupled to the single-ended winding; and

    a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area.

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