COPPER BONDING METHOD
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Accused Products
Abstract
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.
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Citations
34 Claims
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1-10. -10. (canceled)
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11. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
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forming a dielectric passivation layer on said bond pad structure; patterning a buffering structure pattern on the dielectric passivation layer; and etching the buffering structure pattern to create a buffering structure in the dielectric passivation layer. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18-20. -20. (canceled)
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21. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
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depositing passivation material upon said bond pad structure; patterning said passivation material to provide a plurality of spaced-apart regions of said passivation material spaced-apart along a first direction, defining a plurality of hiatuses, portions of said bond pad structure in superimposition with said hiatuses being exposed and spaced-apart from a crown surface of said regions a second direction, extending transversely to said first direction. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
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forming a dielectric passivation layer on said bond pad structure; patterning a buffering structure pattern on the dielectric passivation layer to provide a plurality of spaced-apart regions of said passivation material spaced-apart along a first direction, defining a plurality of hiatuses, portions of said bond pad structure in superimposition with said hiatuses being exposed and spaced-apart from a crown surface of said regions a second direction, extending transversely to said first direction.
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- 31. The method of claim 31 further including determining the buffering structure pattern by optimizing an aspect ratio.
Specification