SOLDER ALLOYS AND PROCESS FOR REPAIRING A COMPONENT

• US 20100025454A1
• Filed: 02/26/2008
• Published: 02/04/2010
• Est. Priority Date: 03/14/2007
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Heinz, Paul, Singer, Robert
• Granted Patent: US 8,613,885 B2
• Time in Patent Office: Days
• US Class Current: 228/119
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: C22C 19/007 with a light metal (alkali metal Li, Na, K, Rb, Cs; earth alkali metal Be, Mg, Ca, Sr, Ba, Al Ga, Ge, Ti) or B, Si, Zr, Hf, Sc, Y, lanthanides, actinides, as the next major constituent

Abstract

Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y′ phase and has improved mechanical properties.

Claims

1-75. -75. (canceled)

76. A solder alloy, comprising:

gallium (Ga) and/or germanium (Ge);

optionally comprising;

chromium (Cr);

cobalt (Co);

aluminum (Al);

tungsten (W); and

nickel (Ni),

further comprising one of the following compositions, where G=Ga or Ge;

Ni—

Cr-G;

Ni—

Co-G;

Ni—

W-G;

Ni—

Al-G;

Ni—

Cr—

Co-G

Ni—

Cr—

W-G;

Ni—

Cr—

Al-G;

Ni—

Co—

W-G;

Ni—

Co—

Al-G;

Ni—

W—

Al-G;

Ni—

Cr—

Co—

W-G;

Ni—

Cr—

Co—

Al-G;

Ni—

Cr—

W—

Al-G;

Ni—

Co—

W—

Al-G; and

Ni—

Cr—

Co—

W—

Al-G.

77. The solder alloy as claimed in claim 76, wherein the solder alloy does not comprise a composition selected from the group consisting of:

silicon, carbon, iron, manganese, boron, zirconium, tungsten, chromium, cobalt, and aluminum.

78. The solder alloy as claimed in claim 76,

wherein the solder alloy comprises gallium and no germanium, or

wherein the solder alloy comprises germanium and no gallium, or

wherein the solder alloy comprises germanium and gallium.

79. The solder alloy as claimed in claim 76,

wherein a gallium or germanium content is ≧

3% by weight, in particular 3% by weight,

wherein the gallium or germanium content is ≧

6% by weight, in particular 6% by weight,

wherein the gallium or germanium content is ≦

28% by weight, in particular ≦

18% by weight,

wherein the gallium or germanium content is ≦

13% by weight, in particular 13% by weight,

wherein the gallium or germanium content is ≦

8% by weight, in particular 8% by weight.

80. The solder alloy as claimed in claim 76,

wherein a germanium content is 18% by weight to 28% by weight, in particular 20% by weight, especially 26% by weight,

wherein the germanium content is 21% by weight to 25% by weight, in particular 23% by weight,

wherein a gallium content is 28% by weight to 35% by weight.

81. The solder alloy as claimed in claim 76, wherein the solder alloy contains at least 0.1% by weight of a composition selected from the group consisting of:

chromium, cobalt, aluminum, tungsten, titanium, molybdenum, tantalum.

82. The solder alloy as claimed in claim 76,

wherein the solder alloy consists of nickel, gallium or germanium, and a single further alloying element selected from the group consisting of:

chromium, cobalt, tungsten, and aluminum,

wherein the solder alloy consists of nickel, gallium or germanium, and two further alloying elements selected from the group consisting of;

chromium, cobalt, tungsten, and aluminum,

wherein the solder alloy consists of nickel, gallium or germanium, and three further alloying additions selected from the group consisting of;

chromium, cobalt, tungsten, and aluminum.

83. The solder alloy as claimed in claim 76,

wherein the nickel has the highest proportion by weight, or

wherein the nickel has the highest proportion by volume.

84. The solder alloy as claimed in claim 76,

wherein a chromium content is 2% by weight to 10% by weight, in particular 3% by weight to 9% by weight, especially 8% by weight,

wherein the chromium content is 3% by weight to 5% by weight, in particular 4% by weight.

85. The solder alloy as claimed in claim 76,

wherein a aluminum content is 1% by weight to 5% by weight, in particular 2% by weight to 4% by weight, especially 3% by weight,

wherein the aluminum content is 1.0% by weight to 2.0% by weight, in particular 1.5% by weight.

86. The solder alloy as claimed in claim 76,

wherein a tungsten content is 2% by weight to 6% by weight, in particular 3% by weight to 5% by weight, especially 4% by weight,

wherein the tungsten content is 1% by weight to 3% by weight, in particular 2% by weight.

87. The solder alloy as claimed in claim 76,

wherein a cobalt content is 2% by weight to 10% by weight, in particular 3% by weight to 9% by weight, especially 8% by weight,

wherein the cobalt content is 3% by weight to 5% by weight, in particular 4% by weight.

88. The solder alloy as claimed in claim 76, wherein the solder alloy consists of:

a binary system of nickel and either gallium or germanium, or

a ternary system of nickel, gallium, and germanium.

89. The solder alloy as claimed in claim 76, wherein the solder alloy consists of:

nickel, chromium, cobalt, tungsten, aluminum, and gallium or germanium, or

nickel, germanium, tungsten, and aluminum, or

nickel, germanium, cobalt, and tungsten, or

nickel, germanium, chromium, and tungsten, or

nickel, germanium, chromium, and cobalt, or

nickel, germanium, cobalt, and aluminum, or

nickel, germanium, chromium, and aluminum.

90. A process for repairing a component, comprising:

using a solder for repairing the component at a temperature of at least 1140°

C., especially at least 1160°

C.,

wherein the solder comprising;

gallium (Ga) and/or germanium (Ge);

optionally comprising;

chromium (Cr);

cobalt (Co);

aluminum (Al);

tungsten (W); and

nickel (Ni),

further comprising one of the following compositions, where G=Ga or Ge;

Ni—

Cr-G;

Ni—

Co-G;

Ni—

W-G;

Ni—

Al-G;

Ni—

Cr—

Co-G

Ni—

Cr—

W-G;

Ni—

Cr—

Al-G;

Ni—

Co—

W-G;

Ni—

Co—

Al-G;

Ni—

W—

Al-G;

Ni—

Cr—

Co—

W-G;

Ni—

Cr—

Co—

Al-G;

Ni—

Cr—

W—

Al-G;

Ni—

Co—

W—

Al-G; and

Ni—

Cr—

Co—

W—

Al-G

91. The process as claimed in claim 90,

wherein the soldering process is carried out under isothermal conditions,

wherein the soldering process is carried out by a temperature gradient.

92. The process as claimed in claim 90,

wherein the solder is directionally solidified, in particular in single crystal form,

wherein the solder is solidified in polycrystalline form, in particular in CC components,

wherein the solder is used for alloys PWA 1483, PWA 1484, or Rene N5,

wherein a substrate of the component is directionally solidified, in particular in single crystal form.

93. The process as claimed in claim 90,

wherein the temperature is selected from the group consisting of:

1160°

C., 1180°

C., 1200°

C., 1230°

C., 1260°

C., 1280°

C.,

wherein the temperature is at most 1280°

C., in particular at most 1160°

C.

94. The process as claimed in claim 90,

wherein an overall pressure in a process chamber is set at less than 10 mbar, in particular of about 1 mbar,

wherein an overall pressure in the process chamber is set at more than 0.1 mbar, in particular at more than 1 mbar,

wherein before the component is heated in the process chamber with the solder, the process chamber is purged with an inert gas for at least 10 hours, in particular preferably for 48 hours,

wherein a throughput of the purging operation is between 0.2 l/min and 1 l/min,

wherein the throughput of the purging operation is 1 l/min,

wherein the inert gas has a degree of purity of 6.0 and is filtered through a gas cleaning cartridge before entering into the process chamber.

95. The process as claimed in claim 90, wherein a duration of the soldering process is at least 10 hours, in particular at least 48 hours.