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SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME

  • US 20100025791A1
  • Filed: 07/29/2009
  • Published: 02/04/2010
  • Est. Priority Date: 08/01/2008
  • Status: Active Grant
First Claim
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1. A solid-state imaging device, comprising:

  • a semiconductor substrate including a photodiode formed in an upper face;

    a microlens provided on the semiconductor substrate at a position corresponding to the photodiode;

    an adhesive layer provided on the semiconductor substrate not to cover the microlens;

    a low refractive index layer provided on the semiconductor substrate to cover the microlens, the low refractive index layer formed from a low-refractive-index material having a refractive index lower than a refractive index of a material forming the microlens;

    a transparent substrate covering the adhesive layer and the low refractive index layer, the transparent substrate adhered to the semiconductor substrate by the adhesive layer;

    an interconnect layer provided on a lower face of the semiconductor substrate; and

    an external connection member bonded to a lower face of the interconnect layer.

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