METAL ADHESION BY INDUCED SURFACE ROUGHNESS
First Claim
Patent Images
1. A method of preventing a layer of material from delaminating from a semiconductor surfaces, comprising:
- providing a layer of semiconductor material having opposing surfaces with at least one through via structure extending to at least one of said opposing surfaces;
providing a roughened surface region on said at least one of said opposing surfaces beyond said at least one through via structure to promote adhesion of said layer of material to said at least one of said opposing surfaces; and
forming said layer of material on said at least one of said opposing surfaces.
7 Assignments
0 Petitions
Accused Products
Abstract
Back side metal (BSM) delamination induced by chip dicing of silicon wafers is avoided by roughening the polished silicon surface at chip edges by etching. The Thru-Silicon-Via (TSV) structures used in 3D chip integration is masked at the back side from roughening to maintain the polished surface at the TSV structures and, thus, reliable conductivity to the BSM layer.
158 Citations
25 Claims
-
1. A method of preventing a layer of material from delaminating from a semiconductor surfaces, comprising:
-
providing a layer of semiconductor material having opposing surfaces with at least one through via structure extending to at least one of said opposing surfaces; providing a roughened surface region on said at least one of said opposing surfaces beyond said at least one through via structure to promote adhesion of said layer of material to said at least one of said opposing surfaces; and forming said layer of material on said at least one of said opposing surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method of improving metal adhesion in chip fabrication, comprising:
-
providing a semiconductor wafer with an array of chip regions each having integrated circuits formed at one surface and at least one through via extending from said one surface to the other surface thereof; polishing the said other surface of said wafer to a smooth surface; forming a mask pattern on the said smooth surface of said other surface to cover said at least one through via of each of said chip regions of said array of chip regions leaving dicing lines between each of said chip regions exposed; exposing said dicing lines of said smooth surface of said other surface to a roughening process to roughen said smooth surface along said dicing lines between each of said chip regions while allowing said mask pattern to prevent roughening of said at least one through via of each of said chip regions of said array of chip regions; removing said mask pattern; and forming a layer of metal on said other surface. - View Dependent Claims (12, 13, 14, 15)
-
-
16. A method of improving chip edge adhesion in thru-silicon-via structures, comprising:
-
providing a silicon wafer having an array of chip regions each having integrated circuits formed at one surface and at least one thru-silicon-via structure extending from said one surface to a smooth surface of the other surface thereof with said at least one thru-silicon-via structure at least partially filled with a conductive material extending to the said smooth surface of said other surface thereof of said silicon wafer; forming a mask pattern on the said smooth surface of said other surface to cover said at least one thru-silicon-via of each of said chip regions of said array of chip regions leaving dicing lines between each of said chip regions exposed; exposing the said smooth surface of said other surface to a roughening process to roughen said smooth surface along said dicing lines between each of said chip regions; removing said mask pattern; forming a layer of metal on said other surface; and removing metal from said layer of metal along said dicing lines between each of said chip regions. - View Dependent Claims (17, 18)
-
-
19. A wafer structure comprising:
-
an array of chip regions each having integrated circuits formed at one surface and at least one through via extending from said one surface to the other surface thereof, said other surface being roughened along the dicing lines between each of said chip regions of said array of chip regions and polished at said at least one through via of each of said chip regions; and a layer of material formed on said other surface. - View Dependent Claims (20, 21, 22, 23, 24, 25)
-
Specification