LED LIGHT SOURCE UNIT

• US 20100027261A1
• Filed: 07/20/2007
• Published: 02/04/2010
• Est. Priority Date: 01/30/2007
• Status: Abandoned Application

• Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha (TDK Corporation)
• Original Assignee: Denki Kagaku Kogyo Kabushiki Kaisha (TDK Corporation)
• Inventors: Miyata, Kenji, Yashima, Katsunori, Mitsunaga, Toshikatsu, Okada, Takuya, Nishi, Taiki, Miyakawa, Takeshi, Okajima, Yoshihiko, Takano, Keiji
• Application Number:
  US12/525,166
• Publication Number:
  US 20100027261A1
• Time in Patent Office: Days
• US Class Current: 362/249.20
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 7/00 Use of ingredients characterised by shape
• CPC Class Codes: C09J 133/02 Homopolymers or copolymers of acids; Metal or ammonium salts thereof
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2433/00 Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 2483/006 in the substrate
• CPC Class Codes: C09J 7/25 based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life.

An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between a rear side conductor circuit and a metal housing is at least 1.0 kV.

Claims

1. An LED light source unit comprising a printed board, at least one light emitting diode (LED) provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between a rear side conductor circuit and a metal housing is at least 1.0 kV.

2. The LED light source unit according to claim 1, wherein the thickness of the adhesive tape is from 30 to 300 μ

m.

3. The LED light source unit according to claim 1, wherein the thickness of the adhesive tape is from 30 to 50 μ

m.

4. The LED light source unit claim 1, wherein the adhesive tape comprises from 20 to 45 vol % of a polymer resin material made of a copolymer of (meth)acrylic acid with a monomer copolymerizable with (meth)acrylic acid, and from 40 to 80 vol % of an inorganic filler having a particle size of at most 45 μ

m and an average particle size of from 0.3 to 30 μ

m.

5. The LED light source unit according to claim 4, wherein the inorganic filler is at least one member selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, silicon oxide (silica) and aluminum hydroxide.

6. The LED light source unit according to claim 1, wherein the adhesive tape contains glass cloth.

7. The LED light source unit according to claim 1, wherein the adhesive tape comprises a silicone rubber sheet having a thermal conductivity of from 2 to 5 W/mK and an adhesive layer containing (meth)acrylic acid, formed on each side of the silicone rubber sheet, wherein the thickness of the silicone rubber sheet is from 100 to 300 μ

m, and the thickness of the adhesive layer formed on each side is from 5 to 40 μ

m.

8. The LED light source unit according to claim 1, wherein the adhesive strength between the adhesive tape and the fixing face of the printed board and the adhesive strength between the adhesive tape and the fixing face of the heat dissipating member, are from 2 to 10 N/cm.

9. The LED light source unit according to claim 1, wherein the printed board is a printed board comprising an insulating layer made of a composite prepreg material having a glass cloth base material impregnated with an epoxy resin, and a copper foil bonded to each side of the insulating layer, wherein a prescribed circuit pattern is formed on the copper foil, and through-holes are formed immediately below said LED mounted on the printed board.

10. The LED light source unit according to claim 9, wherein a plated conductor or a conductor is embedded in the through-holes.

11. The LED light source unit according to claim 1, wherein the printed board is a board having a conductor circuit provided on a metal base plate via an insulating layer comprising a thermoplastic resin or a thermosetting resin and having a thermal conductivity of from 1 to 4 W/mK, wherein the thickness of the metal base plate is from 100 to 500 μ

m, the thickness of the insulating layer is from 20 to 300 μ

m, and the thickness of the conductor circuit is from 9 to 140 μ

m.

12. The LED light source unit according to claim 11, wherein the insulating layer comprises from 25 to 50 vol % of a thermoplastic resin or a thermosetting resin, and the rest being an inorganic filler which has a particle size of at most 100 μ

m and comprises coarse particles having an average particle size of from 10 to 40 μ

m and fine particles having an average particle size of from 0.4 to 1.2 μ

m, and which has a sodium ion concentration of at most 500 ppm.

13. The LED light source unit according to claim 11, wherein the chloride ion concentration in the thermoplastic resin or the thermosetting resin is at most 500 ppm.

14. The LED light source unit according to claim 11, wherein the thermoplastic resin is at least one fluororesin selected from the group consisting of a tetrafluoroethylene/perfluoroalkoxyethylene copolymer, a tetrafluoroethylene/hexafluoropropylene copolymer and a chlorotrifluoroethylene/ethylene copolymer.

15. The LED light source unit according to claim 11, wherein the thermosetting resin is at least one member selected from the group consisting of an epoxy resin, a phenol resin, a silicone resin and an acrylic resin.

16. The LED light source unit according to claim 11, wherein the thermosetting resin is a bisphenol A or bisphenol F epoxy resin, or a hydrogenated bisphenol A or bisphenol F epoxy resin.

17. The LED light source unit according to claim 11, wherein the thermosetting resin is a bisphenol A or bisphenol F epoxy resin, and contains a novolac resin as an epoxy-curing agent.

18. The LED light source unit according to claim 11, wherein the thermosetting resin is a hydrogenated bisphenol F or A epoxy resin and further contains a linear high molecular weight epoxy resin having an epoxy equivalent of from 800 to 4,000.