PLANAR DOUBLE GATE TRANSISTOR STORAGE CELL
First Claim
1. A semiconductor device suitable for use as a storage cell, comprising:
- a semiconductor body having a top surface and a bottom surface;
a top gate dielectric overlying the semiconductor body top surface;
an electrically conductive top gate electrode overlying the top gate dielectric;
a bottom gate dielectric underlying the semiconductor body bottom surface;
an electrically conductive bottom gate electrode underlying the bottom gate dielectric; and
a charge trapping layer, comprising a plurality of shallow charge traps, overlying the top or underlying the bottom surface of the semiconductor body.
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Accused Products
Abstract
A semiconductor device suitable for use as a storage cell includes a semiconductor body having a top surface and a bottom surface, a top gate dielectric overlying the semiconductor body top surface, an electrically conductive top gate electrode overlying the top gate dielectric, a bottom gate dielectric underlying the semiconductor body bottom surface, an electrically conductive bottom gate electrode underlying the bottom gate dielectric, and a charge trapping layer. The charge trapping layer includes a plurality of shallow charge traps, adjacent the top or bottom surface of the semiconductor body. The charge trapping layer may be of aluminum oxide, silicon nitride, or silicon nanoclusters. The charge trapping layer may located positioned between the bottom gate dielectric and the bottom surface of the semiconductor body.
15 Citations
20 Claims
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1. A semiconductor device suitable for use as a storage cell, comprising:
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a semiconductor body having a top surface and a bottom surface; a top gate dielectric overlying the semiconductor body top surface; an electrically conductive top gate electrode overlying the top gate dielectric; a bottom gate dielectric underlying the semiconductor body bottom surface; an electrically conductive bottom gate electrode underlying the bottom gate dielectric; and a charge trapping layer, comprising a plurality of shallow charge traps, overlying the top or underlying the bottom surface of the semiconductor body. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor fabrication method comprising:
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forming a bottom gate electrode; forming a bottom gate dielectric overlying the bottom gate electrode; forming a charge trapping layer, having a density of shallow charge traps exceeding a specified threshold, overlying the bottom gate electrode; forming a semiconductor body overlying the charge trapping layer; forming a top gate dielectric overlying the semiconductor body; and forming a top gate electrode overlying the top gate dielectric. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of operating a semiconductor device as a storage cell, comprising:
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writing the cell by biasing a top gate electrode overlying a top gate dielectric and a semiconductor body to a first top gate write voltage, biasing a bottom gate electrode underlying a bottom gate dielectric underlying the semiconductor body to a first bottom gate write voltage, biasing a drain electrode laterally positioned adjacent to a transistor channel of the semiconductor body underlying the first gate electrode to a first drain write voltage, and biasing a source terminal laterally positioned adjacent the transistor channel to ground; and reading the cell by biasing the top gate electrode to a top gate read voltage, biasing the bottom gate electrode to a bottom gate read voltage, biasing the drain electrode to a drain read voltage, and biasing the source terminal laterally positioned adjacent the transistor channel to ground wherein said writing includes storing charge in a charge trapping layer of the semiconductor device wherein the charge trapping layer is located in close proximity to a surface of the semiconductor body and includes a plurality of charge traps. - View Dependent Claims (17, 18, 19, 20)
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Specification