STACKABLE OPTOELECTRONICS CHIP-TO-CHIP INTERCONNECTS AND METHOD OF MANUFACTURING
First Claim
1. An optoelectronics chip-to-chip interconnection system comprising:
- at least one substrate;
at least one packaged chip;
at least one O-E board located in close physical proximity to the corresponding said packaged chips, wherein said O-E board comprises;
at least one optical component for conversion of optical signal to electrical signal and/or optical component for conversion of electrical signal to optical signal ; and
at least one waveguide board located in close physical proximity to said O-E board, wherein said waveguide board comprises at least one optical medium;
wherein said at least one optical component may be discrete or in an array.
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Abstract
An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.
37 Citations
24 Claims
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1. An optoelectronics chip-to-chip interconnection system comprising:
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at least one substrate; at least one packaged chip; at least one O-E board located in close physical proximity to the corresponding said packaged chips, wherein said O-E board comprises; at least one optical component for conversion of optical signal to electrical signal and/or optical component for conversion of electrical signal to optical signal ; and at least one waveguide board located in close physical proximity to said O-E board, wherein said waveguide board comprises at least one optical medium; wherein said at least one optical component may be discrete or in an array. - View Dependent Claims (2, 3, 4, 5, 6, 10, 11, 12, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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7. The optical component for optical interconnect system is a hybrid integrated edge emission device comprising:
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a modulator-integrated laser diode comprising; a laser diode; and an electro-absorption modulator; a platform to reflect light in the upward direction; and a carrier for said modulator-integrated laser diode and said platform; wherein said modulator-integrated laser diode is hybridly or monolithically integrated on single wafer and wherein the carrier has a front side and a back side. - View Dependent Claims (8, 9, 13)
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Specification