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STACKABLE OPTOELECTRONICS CHIP-TO-CHIP INTERCONNECTS AND METHOD OF MANUFACTURING

  • US 20100027577A1
  • Filed: 07/31/2007
  • Published: 02/04/2010
  • Est. Priority Date: 02/27/2004
  • Status: Active Grant
First Claim
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1. An optoelectronics chip-to-chip interconnection system comprising:

  • at least one substrate;

    at least one packaged chip;

    at least one O-E board located in close physical proximity to the corresponding said packaged chips, wherein said O-E board comprises;

    at least one optical component for conversion of optical signal to electrical signal and/or optical component for conversion of electrical signal to optical signal ; and

    at least one waveguide board located in close physical proximity to said O-E board, wherein said waveguide board comprises at least one optical medium;

    wherein said at least one optical component may be discrete or in an array.

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