CHIP-SCALED MEMS MICROPHONE PACKAGE

• US 20100027830A1
• Filed: 07/29/2008
• Published: 02/04/2010
• Est. Priority Date: 07/29/2008
• Status: Active Grant

• Current Assignee: Fortemedia, Inc.
• Original Assignee: Fortemedia, Inc.
• Inventors: HSU, Wei-Chan, WU, Li-Te
• Granted Patent: US 7,812,418 B2
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS transducer generates a sound signal according to sound pressure variations. The readout circuit reads the sound signal from the MEMS transducer.

Claims

1. A micro-electro-mechanical-system microphone chip, comprising:

a substrate;

a micro-electro-mechanical-system transducer formed on the substrate, generating a sound signal according to sound pressure variations; and

a readout circuit also formed on the substrate, reading the sound signal from the micro-electro-mechanical-system transducer.

2. The micro-electro-mechanical-system microphone chip as claimed in claim 1, wherein the micro-electro-mechanical-system transducer comprises a flexible diaphragm vibrating according to sound pressure variations, and a rigid back plate spaced apart from the flexible diaphragm.

3. The micro-electro-mechanical-system microphone chip as claimed in claim 2, wherein the back plate of the micro-electro-mechanical-system transducer is perforated.

4. The micro-electro-mechanical-system microphone chip as claimed in claim 1, wherein the readout circuit is a complementary metal-oxide semiconductor circuit.

5. The micro-electro-mechanical-system microphone chip as claimed in claim 1, further comprising a plurality of side walls encircling the micro-electro-mechanical-system transducer and the readout circuit on the substrate.

6. The micro-electro-mechanical-system microphone chip as claimed in claim 1, further comprising a bumping ball formed on the substrate and electrically connected to the readout circuit.

7. The micro-electro-mechanical-system microphone chip as claimed in claim 1, further comprising a bumping ball formed on the substrate and electrically connected to a constant voltage through the substrate.

8. A microphone package, comprising:

a circuit board; and

a micro-electro-mechanical-system microphone chip, mounted on the circuit board, comprising a substrate, a micro-electro-mechanical-system transducer formed on the substrate, and a readout circuit also formed on the substrate,

wherein the micro-electro-mechanical-system transducer generates a sound signal according to sound pressure variations, and the readout circuit reads the sound signal from the micro-electro-mechanical-system transducer.

9. The microphone package as claimed in claim 8, wherein the micro-electro-mechanical-system transducer comprises a flexible diaphragm vibrating according to sound pressure variations, and a rigid back plate spaced apart from the flexible diaphragm.

10. The microphone package as claimed in claim 9, wherein the back plate of the micro-electro-mechanical-system transducer is perforated.

11. The microphone package as claimed in claim 8, wherein the readout circuit is a complementary metal-oxide semiconductor circuit.

12. The microphone package as claimed in claim 8, wherein the micro-electro-mechanical-system microphone chip further comprises a plurality of side walls encircling the micro-electro-mechanical-system transducer and the readout circuit on the substrate, and separating the circuit board from the substrate.

13. The microphone package as claimed in claim 12, wherein a back chamber is formed by the side walls, the circuit board, and the substrate, and the circuit board has a through hole connected to an interior of the back chamber.

14. The microphone package as claimed in claim 12, wherein the side walls, the circuit board, and the substrate are electrically connected to a constant voltage so as to form a means for shielding, thus protecting the micro-electro-mechanical-system transducer from radio frequency interference.

15. The microphone package as claimed in claim 14, wherein the substrate has a contact electrically connected to the constant voltage, and the micro-electro-mechanical-system microphone chip further comprises a bumping ball formed on the substrate and electrically connected to the contact as well as the circuit board.

16. The microphone package as claimed in claim 8, wherein the micro-electro-mechanical-system microphone chip further comprises a bumping ball formed on the substrate and electrically connected between the readout circuit and the circuit board.

17. An electronic device, comprising:

a circuit board;

a system board electrically connected to the circuit board; and

a micro-electro-mechanical-system microphone chip, mounted on the circuit board, comprising a substrate, a micro-electro-mechanical-system transducer formed on the substrate, and a readout circuit also formed on the substrate,

wherein the micro-electro-mechanical-system transducer generates a sound signal according to sound pressure variations, and the readout circuit reads the sound signal from the micro-electro-mechanical-system transducer.

18. The electronic device as claimed in claim 17, wherein the micro-electro-mechanical-system transducer comprises a flexible diaphragm vibrating according to sound pressure variations, and a rigid back plate spaced apart from the flexible diaphragm.

19. The electronic device as claimed in claim 18, wherein the back plate of the micro-electro-mechanical-system transducer is perforated.

20. The electronic device as claimed in claim 17, wherein the readout circuit is a complementary metal-oxide semiconductor circuit.

21. The electronic device as claimed in claim 17, wherein the micro-electro-mechanical-system microphone chip further comprises a plurality of side walls encircling the micro-electro-mechanical-system transducer and the readout circuit on the substrate, and separating the circuit board from the substrate.

22. The electronic device as claimed in claim 21, wherein a back chamber is formed by the side walls, the circuit board, and the substrate, and the circuit board has a through hole connected to an interior of the back chamber.

23. The electronic device as claimed in claim 21, wherein the side walls, the circuit board, and the substrate are electrically connected to a constant voltage so as to form a means for shielding, thus protecting the micro-electro-mechanical-system transducer from radio frequency interference.

24. The electronic device as claimed in claim 23, wherein the substrate has a contact electrically connected to the constant voltage, and the micro-electro-mechanical-system microphone chip further comprises a bumping ball formed on the substrate and electrically connected to the contact as well as the circuit board.

25. The electronic device as claimed in claim 17, wherein the micro-electro-mechanical-system microphone chip further comprises a bumping ball formed on the substrate and electrically connected between the readout circuit and the circuit board.