High Bulk Laminated Board Using Embossed Plies and the Method of Manufacture

• US 20100028611A1
• Filed: 02/14/2008
• Published: 02/04/2010
• Est. Priority Date: 02/14/2007
• Status: Active Grant

• Current Assignee: 3A Composites GmbH (Schweiter Technologies AG)
• Original Assignee: BCP Fluted Packaging Limited (Huhtamaki Oyj)
• Inventors: Adie, Victor
• Granted Patent: US 8,900,393 B2
• Time in Patent Office: Days
• US Class Current: 428/166
• CPC Class Codes: B31F 1/07 Embossing , i.e. producing impressions formed by locally deep-drawing, e.g. using rolls provided with complementary profilesB31F1/128 takes precedence; corrugating B31F1/20; embossing in combination with printing B41F19/02, B41M1/24; typewriters for embossing B41J3/38; stamping in combination with deforming B41K3/36
• CPC Class Codes: B31F 2201/0766 the layers being superposed tip to tip
• CPC Class Codes: B31F 2201/0769 the layers being shifted
• CPC Class Codes: B31F 2201/0787 Applying adhesive
• CPC Class Codes: B32B 2317/12 Paper, e.g. cardboard
• CPC Class Codes: B32B 2317/16 Wood, e.g. woodboard, fibreboard, woodchips
• CPC Class Codes: B32B 29/00 Layered products comprising a layer of paper or cardboard
• CPC Class Codes: B32B 29/005 next to another layer of paper or cardboard layer
• CPC Class Codes: B32B 3/28 characterised by a layer comprising a deformed thin sheet , i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled B32B29/08 takes precedence
• CPC Class Codes: B32B 37/20 involving the assembly of continuous webs only
• CPC Class Codes: B32B 38/0036 Heat treatment for heating or cooling of layers during lamination B32B37/06, B32B37/08
• CPC Class Codes: B32B 38/06 Embossing
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: Y10T 156/1018 Subsequent to assembly of laminae
• CPC Class Codes: Y10T 156/1025 to form undulated to corrugated sheet and securing to base with parts of shaped areas out of contact
• CPC Class Codes: Y10T 156/1039 Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 156/1044 of parallel stacked sheets only
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/14 Surface bonding means and/or assembly means with shaping, scarifying, or cleaning joining surface only
• CPC Class Codes: Y10T 428/24562 Interlaminar spaces

Abstract

A high bulk laminated board is produced using one or more embossed plies. A method of producing the laminated board comprises: embossing first and second plies to produce first embossed projections extending from first sides of the first and second plies; placing adhesive on the first embossed projections on the first side of each of the first and second embossed plies; bringing the first and second plies together such that the first embossed projections on the first and second embossed plies are aligned; applying pressure to the first side of each of the first and second embossed plies to cause the first and second embossed plies to adhere together to form a composite ply; and adhering first and second flat outer plies onto first and second sides of the composite ply. Corresponding apparatus is provided.

Claims

1-56. -56. (canceled)

57. A method of producing a laminated board, comprising:

embossing first and second plies to produce first embossed projections extending from first sides of the first and second plies;

placing adhesive on the first embossed projections on the first side of each of the first and second embossed plies;

bringing the first and second plies together such that the first embossed projections on the first and second embossed plies are arranged with a predetermined alignment;

applying pressure to the first side of each of the first and second embossed plies to cause the first and second embossed plies to adhere together to form a composite ply; and

adhering first and second flat outer plies onto first and second sides of the composite ply.

58. The method of claim 57, wherein the embossing of the first and the second plies includes producing embossed projections from second sides of the first and second plies.

59. The method of claim 57, further comprising conditioning the first and second plies by the addition of steam before embossing the first and second plies.

60. The method of claim 57, further comprising drying the adhesive on the composite ply before adhering the outer plies to the composite ply.

61. The method of claim 57, further comprising preheating each outer ply before pressing each said outer ply to a respective side of the composite ply.

62. The method of claim 57, wherein each step is carried out on the first and second plies and/or the outer plies simultaneously and symmetrically about the plane of contact of the first and second plies.

63. An apparatus for producing a laminated board, comprising:

embossing means to produce embossed projections extending from first sides of first and second plies respectively;

first adhesive dispensing means to place adhesive on portions of the first side of each of the first and second embossed plies;

first pressure means to press the portions of the first sides of the first and second embossed plies together to form a composite ply at a pressure nip;

second adhesive dispensing means to place adhesive on the first and second sides of the composite ply; and

second pressure means to press first and second outer plies onto the first and second sides of the composite ply.

64. The apparatus of claim 63, wherein the embossing means is further adapted to produce embossed projections extending from second sides of first and second plies respectively.

65. The apparatus of claim 63, wherein the apparatus further comprises means for conditioning the first and second plies by means of steam before the first and second plies are embossed.

66. The apparatus of claim 63, further comprising at least one dryer to dry the first adhesive on the composite ply.

67. The apparatus of claim 63, further comprising preheating means are provided to pre-heat the outer plies before they are fed to the second pressure means.

68. The apparatus of claim 63, wherein each of the means comprised in the apparatus is arranged to act on the first and second plies and/or the outer plies simultaneously and symmetrically about the plane of contact of the first and second plies.

69. A high bulk laminated board, comprising:

a first embossed ply having raised projections; and

first and second flat outer plies, the outer plies being attached to first and second sides of the first embossed ply and each outer ply being of printable quality.

70. The laminated board of claim 69, further comprising a

second embossed ply having raised projections, the first and second embossed plies being attached to each other at the raised projections to form a composite ply;

wherein the outer plies are attached to first and second sides of the composite ply.

71. The laminated board of claim 69, wherein the embossed ply or plies further comprise lowered projections.