GROUP III-NITRIDES ON SI SUBSTRATES USING A NANOSTRUCTURED INTERLAYER
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Abstract
A layered group III-nitride article includes a single crystal silicon substrate, and a highly textured group III-nitride layer, such as GaN, disposed on the silicon substrate. The highly textured group III-nitride layer is crack free and has a thickness of at least 10 μm. A method for forming highly textured group III-nitride layers includes the steps of providing a single crystal silicon comprising substrate, depositing a nanostructured InxGa1-xN (1≧x≧0) interlayer on the silicon substrate, and depositing a highly textured group III-nitride layer on the interlayer. The interlayer has a nano indentation hardness that is less than both the silicon substrate and the highly textured group III-nitride layer.
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Citations
13 Claims
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1-4. -4. (canceled)
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5. A method for forming highly textured group III-nitride layers, comprising the steps of:
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providing a single crystal silicon comprising substrate; depositing a nanostructured InxGa1-xN (1≧
x≧
0) interlayer on said silicon substrate, the nanostructured InxGa1-xN interlayer being in contact with said silicon substrate; anddepositing a highly textured group III-nitride layer on said interlayer, wherein said interlayer has a nano indentation hardness that is less than both said silicon substrate and said highly textured group III-nitride layer. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13)
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Specification