LED REFLECTING PLATE AND LED DEVICE

• US 20100032693A1
• Filed: 10/19/2009
• Published: 02/11/2010
• Est. Priority Date: 09/16/2004
• Status: Abandoned Application

• Current Assignee: Hideki Yoshida, Ryouji Sugiura
• Original Assignee: Hideki Yoshida, Ryouji Sugiura
• Inventors: Yoshida, Hideki, Sugiura, Ryouji
• Application Number:
  US12/581,828
• Publication Number:
  US 20100032693A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

Claims

1. An LED device comprising:

an LED chip;

an LED reflecting plate made of a metal and having a recess where said LED chip is to be mounted; and

a printed wiring board on which said LED reflecting plate is to be mounted,

said printed wiring board comprising

a first through hole in which the recess of said LED reflecting plate is to be fitted, and

a terminal portion formed on a surface of said printed wiring board to be electrically connected to said LED chip,

said LED reflecting plate comprising

a flat LED chip mounting portion which forms a bottom of the recess, and

a reflecting portion which forms a side wall of the recess and is inclined with respect to said LED chip mounting portion,

said LED device further comprising

a thin metal wire which electrically connects said LED chip and said terminal portion of said printed wiring board,

said LED reflecting plate further comprising

a flat flange around the recess, and

said printed wiring board further comprising

a first substrate formed with the first through hole,

a second substrate which sandwiches, together with said first substrate, said flange of said LED reflecting plate the recess of which is fitted in the first through hole, and

a second through hole which is formed in said second substrate and through which said thin metal wire connected to said LED chip on said LED reflecting plate is extended.

2. An LED device according to claim 1, wherein a plurality of LED chips are mounted on each recess of said LED reflecting plate.

3. An LED device according to claim 1, wherein said printed wiring board further comprises

an electrical connection hole formed in a portion of said second substrate which is above said flange, and

a wiring line which is formed on a surface of said second substrate and electrically connects the electrical connection hole to said terminal portion.