SIGNAL COUPLER
First Claim
1. A signal coupler comprising;
- a first coil being formed over a semiconductor substrate, the first coil including a first pad-pair and a first metal wiring, the first pad-pair including two first pads, the first metal wiring being perpendicularly configured as a half-loop over the semiconductor substrate, both ends of the first metal wiring being bonded to each of the first pad, respectively;
an input circuit being configured in the semiconductor substrate and providing electrical current corresponding to an input signal to the first metal wiring;
a second coil being opposed to the first coil and formed over the semiconductor substrate, the second coil including a second pad-pair and a second metal wiring, the second pad-pair including two second pads, the second metal wiring being perpendicularly configured as the half-loop over the semiconductor substrate, both ends of the second metal wiring being bonded to each of the second pad, respectively, the second coil detecting magnetic field variation generated in the vicinity of the first coil and generating an output electrical current corresponding to the magnetic field variation; and
an output circuit being configured in the semiconductor substrate and outputting an output signal corresponding to the output electrical current.
1 Assignment
0 Petitions
Accused Products
Abstract
According to an aspect of the present invention, there is provided a signal coupler including, a first coil being formed over a semiconductor substrate, the first coil including a first pad-pair and a first metal wiring, the first pad-pair including two first pads, the first metal wiring being perpendicularly configured as a half-loop over the semiconductor substrate, both ends of the first metal wiring being bonded to each of the first pad, respectively, an input circuit being configured in the semiconductor substrate and providing electrical current corresponding to an input signal to the first metal wiring, a second coil being opposed to the first coil and formed over the semiconductor substrate, the second coil including a second pad-pair and a second metal wiring, the second pad-pair including two second pads, the second metal wiring being perpendicularly configured as the half-loop over the semiconductor substrate, both ends of the second metal wiring being bonded to each of the second pad, respectively, the second coil detecting magnetic field variation generated in the vicinity of the first coil and generating an output electrical current corresponding to the magnetic field variation, and an output circuit being configured in the semiconductor substrate and outputting an output signal corresponding to the output electrical current.
2 Citations
20 Claims
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1. A signal coupler comprising;
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a first coil being formed over a semiconductor substrate, the first coil including a first pad-pair and a first metal wiring, the first pad-pair including two first pads, the first metal wiring being perpendicularly configured as a half-loop over the semiconductor substrate, both ends of the first metal wiring being bonded to each of the first pad, respectively; an input circuit being configured in the semiconductor substrate and providing electrical current corresponding to an input signal to the first metal wiring; a second coil being opposed to the first coil and formed over the semiconductor substrate, the second coil including a second pad-pair and a second metal wiring, the second pad-pair including two second pads, the second metal wiring being perpendicularly configured as the half-loop over the semiconductor substrate, both ends of the second metal wiring being bonded to each of the second pad, respectively, the second coil detecting magnetic field variation generated in the vicinity of the first coil and generating an output electrical current corresponding to the magnetic field variation; and an output circuit being configured in the semiconductor substrate and outputting an output signal corresponding to the output electrical current. - View Dependent Claims (2, 3, 4)
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5. A signal coupler comprising;
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a first coil including a plurality of turns, being formed over a semiconductor substrate, and being constituted with a plurality of first pad-pairs and a plurality of first metal wirings, each of the first pad-pairs including two first pads and being configured towards a prescribed direction, each of the first metal wirings being perpendicularly formed over the semiconductor substrate as a half-loop, both ends of the first metal wiring being bonded to the first pads, respectively; an input circuit being configured in the semiconductor substrate, the input circuit providing an electrical current corresponding to an input signal to the first coil; a second coil including a plurality of turns, being opposed to the first coil, being formed over the semiconductor substrate, and being constituted with a plurality of second pad-pairs and a plurality of second metal wirings, each of the second pad-pairs including two second pads and being configured towards the prescribed direction, each of the second metal wirings being perpendicularly formed over the semiconductor substrate as the half-loop, both ends of the second metal wiring being bonded to the second pads, respectively, the second coil detecting magnetic field variation generated in the vicinity of the first coil and generating an output electrical current corresponding to magnetic field variation; and an output circuit being formed in the semiconductor substrate and outputting an output electrical current corresponding to an output signal. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification