MEMS PROBE FABRICATION ON A REUSABLE SUBSTRATE FOR PROBE CARD APPLICATION
First Claim
Patent Images
1. A method comprising:
- forming a probe on a substrate using Micro-Electro-Mechanical Systems (MEMS) processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate; and
forming an undercut beneath the probe for detachment of the probe from the substrate.
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Abstract
A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.
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Citations
20 Claims
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1. A method comprising:
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forming a probe on a substrate using Micro-Electro-Mechanical Systems (MEMS) processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate; and forming an undercut beneath the probe for detachment of the probe from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A Micro-Electro-Mechanical Systems (MEMS) probe comprising:
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a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conductive layers of the MEMS probe; a probe body, which comprises; a tip portion to support the contact tip; a spring portion; and a base portion to support the tip portion and the spring portion, the base portion having an exposed broken surface that is formed by detaching the MEMS probe with force from a substrate on which the MEMS probe was fabricated. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A Micro-Electro-Mechanical Systems (MEMS) probe on a substrate, the MEMS probe comprising:
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a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conduct layers of the MEMS probe; a probe body, which comprises; a tip portion to support the contact tip; a spring portion; and a base portion to support the tip portion and the spring portion, the base portion having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate. - View Dependent Claims (15, 16, 17)
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18. A method for fabricating a Micro-Electro-Mechanical Systems (MEMS) probe, the method comprising:
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forming a sacrificial layer on a substrate; forming a first conductive pattern on the sacrificial layer, the first conductive pattern having a shape of a tip base of the MEMS probe; forming a second conductive pattern on the first conductive pattern, the second conductive pattern having a shape of a contact tip of the MEMS probe; and forming a third conductive pattern on the second conductive pattern and the sacrificial layer, the third conductive pattern having a shape of a probe body and an anchoring structure for the MEMS probe. - View Dependent Claims (19, 20)
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Specification