RADIO FREQUENCY INTERCONNECT CIRCUITS AND TECHNIQUES

• US 20100033262A1
• Filed: 11/09/2006
• Published: 02/11/2010
• Est. Priority Date: 09/21/2006
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Crowder, Joseph M., Fallica, Michael C., Dupuis, Patricia S., Licciardello, Joseph A., Francis, John B., Puzella, Angelo M.
• Granted Patent: US 7,671,696 B1
• Time in Patent Office: Days
• US Class Current: 333/33
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09145 Edge details
• CPC Class Codes: H05K 2201/09454 Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/09718 Clearance holes
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Claims

1. A printed circuit board assembly comprising:

a plurality of circuit boards, at least two of said plurality of circuit boards having one or more circuit layers disposed thereon; and

a radio frequency (RF) interconnect having a first portion electrically coupled to at least one circuit layer on a first one of said plurality of circuit boards and having a second portion electrically coupled to at least one circuit layer on a second, different one of said plurality of circuit boards, said RF interconnect having a first RF stub; and

a first RF matching pad electrically coupled to said first RF interconnect, said first RF matching pad disposed on a ground plane layer of one of said plurality of printed circuit boards and said RF matching pad comprising a disc shaped conductive portion coupled to said RF interconnect and a non-conductive relief area provided between the disc shaped conductive portion and the ground plane.

2. The printed circuit board assembly of claim 1 wherein said first RF matching pad is a first one of a plurality of RF matching pads coupled to first said RF interconnect.

3. The printed circuit board assembly of claim 2 wherein at least two of said plurality of RF matching pads coupled to said RF interconnect are disposed on different layers of different circuit boards.

4. The printed circuit board assembly of claim 1 wherein said first RF matching pad comprises:

a conductive disk disposed about said RF interconnect; and

a conductor disposed about and electrically isolated from said conductive disk.

5. The printed circuit board assembly of claim 4 wherein said conductor is disposed about said conductive disk such that a non-conductive annular ring relief area is provided between said conductor and said conductive disk.

6. The printed circuit board assembly of claim 1 wherein said first RF interconnect is a first one of a plurality of RF interconnects.

7. The printed circuit board assembly of claim 6, wherein a second, different one of said plurality of RF interconnects has a first RF matching pad electrically coupled thereto.

8. The printed circuit board assembly of claim 7 wherein the second RF interconnect has a second RF matching pad electrically coupled thereto.

9. A printed circuit board assembly comprising:

a plurality of circuit boards, each of said plurality of circuit boards having one or more circuit layers; and

a first radio frequency (RF) interconnect having a first portion electrically coupled to at least one circuit layer on a first one of said plurality of circuit boards and having a second portion electrically coupled to at least one circuit layer on a second, different one of said plurality of circuit boards, said first RF interconnect having a first RF stub; and

a first RF matching pad coupled to said first RF interconnect, said first RF matching pad for matching an impedance characteristics of the first RF stub coupled to said first RF interconnect.

10. The printed circuit board assembly of claim 9 wherein the first RF stub is disposed proximate a first end of said first RF interconnect.

11. The printed circuit board assembly of claim 10 wherein said first RF interconnect is provided having a second RF stub disposed proximate a second opposite end of said first RF interconnect.

12. The printed circuit board assembly of claim 11 further comprising a second RF matching pad coupled to said first RF interconnect, said second RF matching pad for matching an impedance characteristics of the second RF stub.

13. The printed circuit board assembly of claim 9 wherein said first RF matching pad comprises:

a conductive disk disposed about said RF interconnect; and

a conductor disposed about and electrically isolated from said conductive disk.

14. The printed circuit board assembly of claim 13 wherein said conductor is disposed about said conductive disk such that a non-conductive annular ring relief area is provided between said conductor and said conductive disk.

15. (canceled)

16. (canceled)

17. (canceled)

18. (canceled)

19. (canceled)

20. (canceled)

21. A radio frequency (RF) circuit board comprising:

a plurality of printed circuit boards coupled to provide a printed circuit board assembly having first and second opposing outermost layers corresponding to RF ground plane layers of the RF circuit board assembly with at least two of said plurality of printed circuit boards having one or more circuit layers disposed thereon; and

a radio frequency (RF) interconnect having a first portion electrically coupled to at least one circuit layer on a first one of the at least two of said plurality of circuit boards and having a second portion electrically coupled to at least one circuit layer on a second, different one of said plurality of circuit boards, said RF interconnect having a first portion thereof corresponding to a first RF stub; and

a first RF matching pad electrically coupled to said first RF interconnect, said first RF matching pad disposed on a ground plane layer of one of said plurality of printed circuit boards and said RF matching pad comprising a disc shaped conductive portion coupled to said RF interconnect and a non-conductive relief area provided between the disc shaped conductive portion and the ground plane.

22. The printed circuit board assembly of claim 21 wherein:

said printed circuit board assembly is provided having first and second opposing outermost layers; and

said RF interconnect extends from the first outermost layer of said printed circuit board assembly to the second outermost layer of said printed circuit board assembly and wherein the first RF stub extends from a first one of said first and second outermost layers through at least one printed circuit board in a direction toward a second one of said first and second outermost layers.

23. The printed circuit board assembly of claim 22 wherein said RF interconnect extends in a substantially vertical direction from the first outermost layer of said printed circuit board assembly to the second outermost layer of said printed circuit board assembly and wherein the first RF stub extends from a first one of said first and second outermost layers through at least one printed circuit board in a substantially vertical direction toward a second one of said first and second outermost layers.

24. The printed circuit board assembly of claim 22 wherein said first and second outermost layers correspond to ground plane layers through at least one printed circuit board in a substantially vertical direction toward a second one of said first and second outermost layers.

25. The printed circuit board assembly of claim 23 wherein said RF interconnect is provided having a second portion thereof corresponding to a second RF stub and wherein said second RF stub extends from a second one of said first and second outermost layers through at least one printed circuit board in a substantially vertical direction toward the first one of said first and second outermost layers.