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HARDWARE INITIATED THROUGHPUT (HITM) MEASUREMENT INSIDE AN OCP SYSTEM USING OCP SIDE BAND SIGNALS

  • US 20100034248A1
  • Filed: 08/08/2008
  • Published: 02/11/2010
  • Est. Priority Date: 08/08/2008
  • Status: Active Grant
First Claim
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1. A system of an integrated circuit comprising:

  • a signal line located in the integrated circuit to communicate an electrical signal;

    a receiver circuit located in the integrated circuit coupled to the signal line;

    a transmitter module located in the integrated circuit to communicate a data stream to the receiver circuit through the signal line; and

    a throughput monitor circuit coupled to the signal line to measure a throughput value during a communication period of the data stream from the transmitter module.

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