Powder-Fiber Adhesive

• US 20100038240A1
• Filed: 06/13/2006
• Published: 02/18/2010
• Est. Priority Date: 06/22/2005
• Status: Abandoned Application

• Current Assignee: WC Heraeus GmbH (Heraeus Holding GMBH)
• Original Assignee: WC Heraeus GmbH (Heraeus Holding GMBH)
• Inventors: Preissler, Peter, Josef Heindel, Josef Heindel, Simons, Christoph, Schlott, Martin
• Application Number:
  US11/993,686
• Publication Number:
  US 20100038240A1
• Time in Patent Office: Days
• US Class Current: 204/298.130
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: H01J 37/3435 Target holders (includes backing plates and endblocks)
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y10T 442/2738 Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith

Abstract

An adhesive is provided, in particular for the adhesion of conductive materials, having at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder contain an electrically conductive material. Further, an assembly is provided made of a sputtering target material and a carrier material with an adhesive.

Claims

1-11. -11. (canceled)

12. An adhesive for adhesion of conductive materials, comprising at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder comprises an electrically conductive material.

13. The adhesive according to claim 12, wherein the electrically conductive material is selected from the group Ag, Au, Al, Cu, Fe, Ni, stainless steel, W, Zn, C, and their alloys.

14. The adhesive according to claim 12, wherein the binder component is embedded in a matrix made of the fibers or fiber-powder mixture or the fibers or fiber-powder mixture is embedded in the binder matrix.

15. The adhesive according to claim 12, wherein the fillers comprise the fibers in a form of a woven fabric, knitted fabric, knotted fabric, or nonwoven fabric.

16. The adhesive according to claim 12, wherein the fillers comprise the fibers in a proportion of 5 to 60 vol.-% of the adhesive.

17. The adhesive according to claim 12, wherein the binder component is based on a monomer or polymer

18. The adhesive according to claim 12, wherein the binder component is based on an epoxy compound or an epoxy resin.

19. The adhesive according to claim 12, wherein the binder component is curable at temperatures less than 100 C.

20. An assembly comprising a sputtering target material and a carrier material, wherein the sputtering target material is adhered onto the carrier material with an adhesive gap bridged by an adhesive according to claim 12.

21. The assembly according to claim 20, wherein the sputtering target material comprises a material based on Mo, Nb, Cr, W, Ta, Zr, Al, or Si.

22. The assembly according to claim 20, wherein the sputtering target material comprise a ceramic.

23. The assembly according to claim 22, wherein the ceramic is based on tin oxide, zinc oxide, titanium oxide, indium oxide, tantalum oxide, or niobium oxide.

24. The assembly according to claim 20, wherein the sputtering target material has a form of at least one sputtering target tube and the carrier material has a form of a carrier tube.