MICRO MOVABLE DEVICE
First Claim
Patent Images
1. A micro movable device comprising:
- a movable unit formed above a semiconductor substrate;
a protection cap that is arranged above the semiconductor substrate and the movable unit and protects the movable unit;
a signal line that are formed above the semiconductor substrate and transmit a high-frequency signal, a part of the signal line being provided below the movable unit; and
an insulation layer that has a projection formed to project upward from the semiconductor substrate, the projection being provided at outside of the movable unit in a plain view and the insulation layer having a coated surface with the signal line, the coated surface being provided in a higher position than a bottom of the signal line below the movable unit.
1 Assignment
0 Petitions
Accused Products
Abstract
A micro movable device includes a protection cap for protecting a movable unit arranged above a semiconductor substrate and the movable unit, signal line for transmitting a high-frequency signal formed above the semiconductor substrate, and insulation layer that has projection formed to project upward from the semiconductor substrate and coated surfaces with the signal line.
5 Citations
20 Claims
-
1. A micro movable device comprising:
-
a movable unit formed above a semiconductor substrate; a protection cap that is arranged above the semiconductor substrate and the movable unit and protects the movable unit; a signal line that are formed above the semiconductor substrate and transmit a high-frequency signal, a part of the signal line being provided below the movable unit; and an insulation layer that has a projection formed to project upward from the semiconductor substrate, the projection being provided at outside of the movable unit in a plain view and the insulation layer having a coated surface with the signal line, the coated surface being provided in a higher position than a bottom of the signal line below the movable unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A micro movable device comprising:
-
a movable unit formed above a semiconductor substrate; a first insulation layer formed above the semiconductor substrate below the movable unit with a gap between the movable unit and the first insulation layer; a protection cap that is arranged above the first insulation layer and the movable unit and protects the movable unit; a first signal line that is arranged at inside of the protection cap and is formed on the first insulation layer with a gap between the movable unit and the first signal line and a part of the first signal being provided below the movable unit and the first insulation layer; a second insulation layer that are arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer; and a second signal line electrically connected to the first signal line, and coating a surface of the projection of the second insulation layer, the second signal line being provided in a higher position than the part of the first signal line. - View Dependent Claims (10, 11, 12, 13, 14, 15)
-
-
16. A micro movable device comprising:
-
a movable unit formed above a semiconductor substrate; a first insulation layer formed above the semiconductor substrate below the movable unit with a gap between the movable unit and the insulation layer; a protection cap that is arranged above the first insulation layer and the movable unit and protects the movable unit; a first signal line that is arranged at inside of the protection cap and is formed on the first insulation layer with a gap between the movable unit and the first signal line; a second insulation layer that is arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer; a second signal line electrically connected to the first signal line, and coating a surface of the projection of the second insulation layer; a first ground line that is arranged at inside of the protection cap and is formed on the first insulation layer; a third insulation layer that is arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer; and a second ground line electrically connected to the first ground line and coating an entire exposed surface of the third insulation layer. - View Dependent Claims (17, 18, 19, 20)
-
Specification