MICROELECTROMICHANICAL SYSTEM PACKAGE WITH STRAIN RELIEF BRIDGE
First Claim
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1. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
- a first substrate;
a second substrate;
a elastically deformable element positioned between the first substrate and the second substrate, the elastically deformable element being connectable to a MEMS device;
a plurality of contact members applied to the first substrate and the second substrate, the plurality of contact members at least partially surrounding the elastically deformable element, the plurality of contact members being connectable to a circuit board; and
wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.
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Abstract
A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.
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Citations
37 Claims
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1. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
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a first substrate; a second substrate; a elastically deformable element positioned between the first substrate and the second substrate, the elastically deformable element being connectable to a MEMS device; a plurality of contact members applied to the first substrate and the second substrate, the plurality of contact members at least partially surrounding the elastically deformable element, the plurality of contact members being connectable to a circuit board; and wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 14, 15, 16)
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12. A MicroElectroMechanical System (MEMS) package comprising:
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a MEMS device; a circuit board; and a elastically deformable bridge member coupled to the MEMS device and the circuit board, the elastically deformable bridge member at least partially absorbing and dissipating mechanical strain communicated from the circuit board to the elastically deformable bridge member before the mechanical strain can reach the MEMS device. - View Dependent Claims (13)
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17. A method for manufacturing a MicroElectroMechanical (MEMS) package comprising:
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forming a first substrate and a second substrate; forming a elastically deformable element between the first substrate and the second substrate; coupling a MEMS device to the elastically deformable element; applying a plurality of contact members to the first substrate and the second substrate so as to at least partially surround the elastically deformable element; and attaching a circuit board to the contact members. - View Dependent Claims (18, 19, 20)
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21. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
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a first substrate configured to be attachable to a circuit board; a first elastically deformable element coupled to the first substrate, the first elastically deformable element configured to be attachable to a MicroElectroMechanical (MEMS) device; and wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
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a first substrate wherein the first substrate is configured to be coupled to a MicroElectroMechanical (MEMS) device; and a first elastically deformable element coupled to the first substrate and which at least partially absorbs and dissipates mechanical strain communicated from a circuit board before the mechanical strain can reach the MEMS device. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification