Wireless Telemetry Electronic Circuit Board for High Temperature Environments
First Claim
1. A circuit assembly resistant to high-temperature and high centrifugal (g) forces comprising:
- a printed circuit board fabricated from alumina and having conductive traces of said circuit deposited thereon;
active and passive components of said circuit assembly being attached to said printed circuit board by means of gold powder diffused under high temperature; and
,gold wire bonding between said circuit traces and said active components in order to complete said circuit assembly, said wire bonding being oriented parallel to a direction of centrifugal forces to be exerted upon said circuit assembly and having a diameter within the range of 0.7 mil and 1.0 mil.
3 Assignments
0 Petitions
Accused Products
Abstract
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
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Citations
15 Claims
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1. A circuit assembly resistant to high-temperature and high centrifugal (g) forces comprising:
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a printed circuit board fabricated from alumina and having conductive traces of said circuit deposited thereon; active and passive components of said circuit assembly being attached to said printed circuit board by means of gold powder diffused under high temperature; and
,gold wire bonding between said circuit traces and said active components in order to complete said circuit assembly, said wire bonding being oriented parallel to a direction of centrifugal forces to be exerted upon said circuit assembly and having a diameter within the range of 0.7 mil and 1.0 mil. - View Dependent Claims (2, 3, 4, 5, 6)
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7. In a combustion turbine engine, a circuit assembly affixed to a stationary or moving part of said turbine engine for receiving sensed information about the condition of said part and transmitting said sensed information to a receiver external to said turbine engine, said circuit assembly comprising:
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a printed circuit board comprising an alumina substrate and having conductive traces formed of a thick film gold paste deposited thereon; active and passive components of said circuit assembly being attached to said printed circuit board by means of gold powder diffused under high temperature; and
,gold wire bonding between said circuit traces and said active components in order to complete said circuit assembly, said gold wire bonding being oriented parallel to a direction of centrifugal forces to be exerted upon said circuit during operation of the turbine engine. - View Dependent Claims (8, 15)
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9. A method for manufacturing a circuit assembly resistant to elevated temperature and high g forces, said method comprising the steps of:
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locating a printed circuit board inside a transfer plate, said printed circuit board having gold circuit traces formed thereon; positioning an alignment plate over said printed circuit board, said alignment plate having openings therein corresponding to size and location of components to be attached to said printed circuit board; depositing gold powder in said openings of said alignment plate; depositing said components inside of said openings in said alignment plate; clamping said transfer plate containing said circuit assembly between a pair of heated graphite plates and subjecting all to elevated temperatures, whereby said gold powder diffuses into said printed circuit board and into said components, thereby forming a secure bond that can withstand elevated temperatures and high g-forces. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification