Package-Integrated Thin Film LED

• US 20100041170A1
• Filed: 02/09/2009
• Published: 02/18/2010
• Est. Priority Date: 10/28/2004
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Philips Lumileds Lighting Company LLC (Apollo Global Management, Inc.), Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Krames, Michael R., Martin, Paul S., Epler, John E.
• Granted Patent: US 7,875,533 B2
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/206 Length ranges
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.

Claims

1. A method comprising:

providing light emitting diode (LED) layers grown on a growth substrate, the LED layers comprising a first epitaxial layer of a first conductivity type, a second epitaxial layer of a second conductivity type, and an active layer disposed between the first and second epitaxial layers, wherein a primary emission surface on a first side of the first epitaxial layer is substantially parallel to the active layer, the LED layers forming at least one individual LED;

providing a package substrate comprising a support surface having one or more electrical contact pads thereon for electrical connection to the first and second epitaxial layers;

placing the LED layers attached to the growth substrate on the package substrate such that the second epitaxial layer is facing a contact pad on the package substrate;

introducing an underfill material in a void between the LED layers and the package substrate;

bonding the second epitaxial layer to the first contact pad using a metal interface disposed between the package substrate and the second epitaxial layer; and

removing the growth substrate.

2. The method of claim 1 wherein a lateral extent of the package substrate exceeds that of an individual LED.

3. The method of claim 1 wherein a nearest distance between the primary emission surface and a portion of the package substrate is not more than 50 microns.

4. The method of claim 1 wherein the underfill material is configured to reduce thermal gradients across the LED layers.

5. The method of claim 1 wherein the underfill material is configured to add mechanical strength to an attachment between the LED layers and the package substrate.

6. The method of claim 1 wherein the underfill material is configured to prevent contaminants from contacting the LED layers.

7. The method of claim 1 further comprising:

depositing a protective layer over the package substrate after the LED layers have been placed on the package substrate to protect the package substrate; and

etching a portion of the first epitaxial layer.

8. The method of claim 1 further comprising:

providing a first metal electrode on the first epitaxial layer and a second metal electrode on the second epitaxial layer, wherein the first and second metal electrodes are on a same side of the LED.

9. The method of claim 8 wherein the first metal electrode is formed in a pattern across the first epitaxial layer.

10. The method of claim 9 wherein the pattern comprises one of fingers and polka dots.

11. The method of claim 8 wherein the first and second metal electrodes are separated by an insulating material.

12. The method of claim 8 further comprising providing an insulating layer and a conducting layer formed over the first and second metal electrodes.

13. The method of claim 1 further comprising dicing the LED layers and growth substrate prior to placing the LED layers on the package substrate.

14. The method of claim 1 wherein said introducing an underfill occurs prior to removing the growth substrate.

15. A method comprising:

providing light emitting diode (LED) layers grown on a growth substrate, the LED layers comprising a first epitaxial layer of a first conductivity type, a second epitaxial layer of a second conductivity type, and an active layer disposed between the first and second epitaxial layers, wherein a primary emission surface on a first side of the first epitaxial layer is substantially parallel to the active layer, the LED layers forming at least one individual LED;

providing a package substrate comprising a support surface having one or more electrical contact pads thereon for electrical connection to the first and second epitaxial layers;

placing the LED layers attached to the growth substrate on the package substrate such that the second epitaxial layer is facing a contact pad on the package substrate;

forming a protective layer over the LED layers and the package substrate after placing the LED layers on the package substrate;

bonding the second epitaxial layer to the first contact pad using a metal interface disposed between the package substrate and the second epitaxial layer;

removing a portion of the protective layer overlying the growth substrate; and

removing the growth substrate.

16. The method of claim 15 wherein the protective layer comprises polyimide.

17. The method of claim 15 wherein the protective layer comprises aluminum oxide.

18. The method of claim 15 wherein removing a portion of the protective layer comprises removing by a planarization step.

19. The method of claim 15 wherein removing a portion of the protective layer comprises removing by etching.