HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE

• US 20100043203A1
• Filed: 10/28/2009
• Published: 02/25/2010
• Est. Priority Date: 04/25/2005
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: LINKMANN, Ralf, KIEHNE, Werner, FERGUSON, Scott Wayne
• Granted Patent: US 8,531,297 B2
• Time in Patent Office: Days
• US Class Current: 29/593
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 2224/75822 Rotational mechanism
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components

Abstract

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Claims

1. A method of making an RFID device, comprising:

testing an RFID circuit that is on a web of RFID circuits;

if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID circuit separation device;

separating the non-defective RFID circuit from the web of RFID circuits with a singulating member;

directing the non-defective RFID circuit onto a rotary placement device and holding the non-defective RFID circuit with a negative pressure with a singulating member; and

placing the non-defective RFID circuit onto an electrical component with the rotary placement device;

if the RFID circuit is determined by the testing to be defective, advancing the defective RFID circuit to a scrap RFID web removal device; and

removing the defective RFID circuit from the web, with the scrap RFID web removal device.

2. The method of claim 1, wherein the step of advancing the defective RFID circuit on the web includes advancing the defective RFID circuit to a location downstream of the RFID circuit separation device.

3. The method of claim 1, wherein the step of removing the defective RFID circuit with the scrap RFID web removal device includes cutting the web of RFID circuits.

4. The method of claim 1, wherein the step of removing the defective RFID circuit with the scrap RFID web removal device includes collecting the scrap RFID circuit web in a receptacle.

5. The method of claim 1, wherein the RFID circuit is provided on a strap or interposer.

6. The method of claim 1, wherein the step of separating includes severing the RFID circuit from the web RFID circuits and directing the RFID circuit onto the rotary placement device.

7. The method of claim 1, wherein the web of RFID circuits is advanced cooperatively with the scrap RFID web removal device through the RFID circuit separation device.

8. The method of claim 1, further comprising separably coupling the non-defective RFID circuit to the singulating member while directing the non-defective RFID circuit to the rotary placement device.

9. A method of making an RFID device, comprising the steps of;

advancing a web of RFID circuits at a first speed;

testing each of the RFID circuits;

if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID separation device;

rotating a rotary placement device to pick up the non-defective RFID circuit from the RFID separation device at the first speed;

transferring the non-defective RFID circuit from the rotary placement device to an electrical component web at a second speed;

if the RFID circuit is determined by the testing to be defective,

advancing the defective RFID circuit to a scrap RFID web removal device; and

moving the web of RFID circuits and scrap RFID web removal device cooperatively with one another.

10. The method of claim 9, wherein the first speed is different than the second speed.

11. The method of claim 9, wherein the electrical component web is a web of antennas.

12. The method of claim 9, including a further step of die cutting the web of RFID circuits after the step of advancing to form singulated RFID circuits.

13. The method of claim 9 wherein the web of RFID circuits is provided at a first pitch and the electrical component web has a second pitch different than the first pitch.

14. The method of claim 9, including a further step of bonding the non-defective RFID circuit to the electrical component web after the step of transferring.

15. The method of claim 14, wherein the step of bonding is accomplished by one of heat, adhesive, pressure, actinic radiation or combinations thereof.

16. The method of claim 9, wherein the step of rotating the rotary placement device is performed at different speeds.

17. A method of making an RFID device, comprising the steps of:

advancing a web of RFID circuits at a first speed;

testing each of the RFID circuits;

marking each RFID circuit that is defective;

reading each of the RFID circuits on the web;

if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID separation device;

moving a placement device to pick up the non-defective RFID circuit from the RFID separation device at the first speed;

transferring the non-defective RFID circuit from the placement device to an electrical component web at a second speed;

if the RFID circuit is determined by the testing to be defective; and

advancing the defective RFID circuit to a scrap RFID web removal device.

18. The method of claim 17, wherein the separation device includes singulating the RFID circuit from the web of RFID circuits.

19. The method of claim 17, wherein the web of RFID circuit has a first pitch and the electrical component web has a second pitch difference than the first pitch.

20. The method of claim 19, wherein the first pitch is greater than the second pitch.