Horizontally Split Vias

• US 20100044096A1
• Filed: 08/19/2008
• Published: 02/25/2010
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Vermilyea, Paul Alan, Kuczynski, Joseph, Splittstoesser, Kevin Albert, Tofil, Timothy Jerome
• Granted Patent: US 8,136,240 B2
• Time in Patent Office: Days
• US Class Current: 174/266
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 2203/056 Using an artwork, i.e. a photomask for exposing photosensitive layers
• CPC Class Codes: H05K 2203/0565 Resist used only for applying catalyst, not for plating itself
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 3/422 characterised by electroless plating method; pretreatment therefor
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A mechanism is disclosed for providing horizontally split vias are provided in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×.

Claims

1. An apparatus, comprising:

a substrate having a plurality of insulator layers and internal conductive traces, wherein a first through-hole extends completely through the substrate from a first surface of the substrate to a second surface of the substrate, wherein the first through-hole passes through a first and a second of the internal conductive traces, and wherein the second internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the first internal conductive trace;

a first conductive via plated onto the first through-hole, wherein the first conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the first internal conductive trace;

a second conductive via plated onto the first through-hole, wherein the second conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the second internal conductive trace.

2. The apparatus as recited in claim 1, wherein a second through-hole extends completely through the substrate from the substrate'"'"'s first surface to the substrate'"'"'s second surface, wherein the second through-hole passes through a third and a fourth of the internal conductive traces, and wherein the fourth internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the third internal conductive trace, the apparatus further comprising:

a third conductive via plated onto the second through-hole, wherein the third conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the third internal conductive trace;

a fourth conductive via plated onto the second through-hole, wherein the fourth conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the fourth internal conductive trace.

3. The apparatus as recited in claim 2, wherein the distance between the first and the second internal conductive traces in the first through-hole is greater than the distance between the third and the fourth internal conductive traces in the second through-hole.

4. The apparatus as recited in claim 2, wherein a third through-hole extends completely through the substrate from the substrate'"'"'s first surface to the substrate'"'"'s second surface, wherein the third through-hole passes through a fifth one of the internal conductive traces, the apparatus further comprising:

a fifth conductive via plated onto the third through-hole, wherein the fifth conductive via extends completely through the substrate from the substrate'"'"'s first surface to the substrate'"'"'s second surface.

5. The apparatus as recited in claim 1, wherein the substrate is an interconnect substrate.

6. The apparatus as recited in claim 1, wherein the substrate is a printed wiring board.

7. A method comprising the steps of:

providing a substrate having a plurality of insulator layers and a plurality of internal conductive traces, wherein a plurality of through-holes extend completely through the substrate from a first surface of the substrate to a second surface of the substrate, wherein a first one of the through-holes passes through a first and a second of the internal conductive traces, and wherein the second internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the first internal conductive trace;

plating a first conductive via onto the first through-hole so that the first conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the first internal conductive trace;

plating a second conductive via onto the first through-hole so that the second conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the second internal conductive trace.

8. The method as recited in claim 7, wherein a second one of the through-holes passes through a third and a fourth of the internal conductive traces, and wherein the fourth internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the third internal conductive trace;

plating a third conductive via onto the second through-hole so that the third conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the third internal conductive trace;

plating a fourth conductive via onto the second through-hole so that the fourth conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the fourth internal conductive trace.

9. The method as recited in claim 7, further comprising the steps of:

providing a plated-through-hole (PTH) plug in the first through-hole, wherein the PTH plug extends from a first end thereof at or adjacent to the first internal conductive trace to a second end thereof at or adjacent to the second internal conductive trace;

providing a seed photoresist on portions of the substrate'"'"'s first and second surfaces, wherein the seed photoresist has open regions in the vicinity of the first through-hole, and wherein the open regions of the seed photoresist expose a portion of the substrate'"'"'s first surface adjacent the first through-hole, a portion of the first through-hole extending from the substrate'"'"'s first surface to the first internal conductive trace, the first end of the PTH plug, a portion of the substrate'"'"'s second surface adjacent the first through-hole, a portion of the first through-hole extending from the substrate'"'"'s second surface to the second internal conductive trace, and the second end of the PTH plug;

applying seed material to the seed photoresist, the exposed portions of the substrate'"'"'s first and second surfaces, the exposed portions of the first through-hole, and the exposed first and second ends of the PTH plug;

stripping the PTH plug and the seed photoresist so that the seed material remains substantially only at a portion of the substrate'"'"'s first surface adjacent the first through-hole, a portion of the first through-hole extending from the substrate'"'"'s first surface to the first internal conductive trace, a portion of the substrate'"'"'s second surface adjacent the first through-hole, and a portion of the first through-hole extending from the substrate'"'"'s second surface to the second internal conductive trace.

10. The method as recited in claim 9, wherein the step of plating the first conductive via onto the first through-hole and the step of plating the second conductive via onto the first through-hole are performed simultaneously and include the step of plating a conductive material onto the portions of the seed material that remain after the stripping step by contacting the substrate with an electroless plating bath.

11. The method as recited in claim 9, wherein the step of providing a plated-through-hole (PTH) plug in the first through-hole comprises the steps of:

laminating the substrate'"'"'s first and second surfaces with a liquid, positive tone photoresist, wherein the liquid, positive tone photoresist substantially fills the first through-hole;

placing a first photomask over the substrate'"'"'s first surface laminated with the liquid, positive tone photoresist, wherein the first photomask includes a variable neutral density pattern having a plurality of exposure attenuation elements, and wherein a first one of the exposure attenuation elements of the first photomask is registered with the first through-hole;

placing a second photomask over the substrate'"'"'s second surface laminated with the liquid, positive tone photoresist, wherein the second photomask includes a variable neutral density pattern having a plurality of exposure attenuation elements, and wherein a first one of the exposure attenuation elements of the second photomask is registered with the first through-hole;

exposing, through the first photomask and the second photomask, the substrate'"'"'s first and second surfaces laminated with the liquid, positive tone photoresist.

12. The method as recited in claim 9, wherein the step of providing a plated-through-hole (PTH) plug in the first through-hole comprises the steps of:

laminating the substrate'"'"'s first and second surfaces with a liquid, positive tone photoresist, wherein the liquid, positive tone photoresist substantially fills the first through-hole;

exposing the liquid, positive tone photoresist in the first through-hole to laser light from the direction of the substrate'"'"'s first surface, wherein the power of the laser light directed into the first through-hole is sufficient to expose the liquid, positive tone photoresist in the first through-hole to a depth at or adjacent to the first internal conductive trace;

exposing the liquid, positive tone photoresist in the first through-hole to laser light from the direction of the substrate'"'"'s second surface, wherein the power of the laser light directed into the first through-hole is sufficient to expose the liquid, positive tone photoresist in the first through-hole to a depth at or adjacent to the second internal conductive trace.

13. The method as recited in claim 8, further comprising the steps of:

providing a first plated-through-hole (PTH) plug in the first through-hole, wherein the first PTH plug extends from a first end thereof at or adjacent to the first internal conductive trace to a second end thereof at or adjacent to the second internal conductive trace;

providing a second plated-through-hole (PTH) plug in the second through-hole, wherein the second PTH plug extends from a first end thereof at or adjacent to the third internal conductive trace to a second end thereof at or adjacent to the fourth internal conductive trace;

providing a seed photoresist on portions of the substrate'"'"'s first and second surfaces, wherein the seed photoresist has open regions in the vicinity of the first and the second through-holes, and wherein the open regions of the seed photoresist expose a portion of the substrate'"'"'s first surface adjacent the first through-hole, a portion of the substrate'"'"'s first surface adjacent the second through-hole, a portion of the first through-hole extending from the substrate'"'"'s first surface to the first internal conductive trace, a portion of the second through-hole extending from the substrate'"'"'s first surface to the third internal conductive trace, the first end of the first and the second PTH plugs, a portion of the substrate'"'"'s second surface adjacent the first through-hole, a portion of the substrate'"'"'s second surface adjacent the second through-hole, a portion of the first through-hole extending from the substrate'"'"'s second surface to the second internal conductive trace, a portion of the second through-hole extending from the substrate'"'"'s second surface to the fourth internal conductive trace, and the second end of the first and the second PTH plugs;

applying seed material to the seed photoresist, the exposed portions of the substrate'"'"'s first and second surfaces, the exposed portions of the first and the second through-holes, and the exposed first and second ends of the first and the second PTH plugs;

stripping the first and the second PTH plugs and the seed photoresist so that the seed material remains substantially only at a portion of the substrate'"'"'s first surface adjacent the first through-hole, a portion of the first through-hole extending from the substrate'"'"'s first surface to the first internal conductive trace, a portion of the substrate'"'"'s first surface adjacent the second through-hole, a portion of the second through-hole extending from the substrate'"'"'s first surface to the third internal conductive trace, a portion of the substrate'"'"'s second surface adjacent the first through-hole, a portion of the first through-hole extending from the substrate'"'"'s second surface to the second internal conductive trace, a portion of the substrate'"'"'s second surface adjacent the second through-hole, and a portion of the second through-hole extending from the substrate'"'"'s second surface to the fourth internal conductive trace.

14. The method as recited in claim 13, wherein the steps of plating the first, second, third and fourth conductive vias onto the first and the second through-holes are performed simultaneously and include the step of plating a conductive material onto the portions of the seed material that remain after the stripping step by contacting the substrate with an electroless plating bath.

15. The method as recited in claim 13, wherein the step of providing a first plated-through-hole (PTH) plug in the first through-hole and the step of providing a second plated-through-hole (PTH) plug in the second through-hole are performed simultaneously and comprise the steps of:

laminating the substrate'"'"'s first and second surfaces with a liquid, positive tone photoresist, wherein the liquid, positive tone photoresist substantially fills the first and the second through-holes;

placing a first photomask over the substrate'"'"'s first surface laminated with the liquid, positive tone photoresist, wherein the first photomask includes a variable neutral density pattern having a plurality of exposure attenuation elements, and wherein a first one and a second one of the exposure attenuation elements of the first photomask are respectively registered with the first and the second through-holes;

placing a second photomask over the substrate'"'"'s second surface laminated with the liquid, positive tone photoresist, wherein the second photomask includes a variable neutral density pattern having a plurality of exposure attenuation elements, and wherein a first one and a second one of the exposure attenuation elements of the second photomask are respectively registered with the first and the second through-holes;

exposing, through the first photomask and the second photomask, the substrate'"'"'s first and second surfaces laminated with the liquid, positive tone photoresist.

16. The method as recited in claim 9, wherein the step of providing a first plated-through-hole (PTH) plug in the first through-hole and the step of providing a second plated-through-hole (PTH) plug in the second through-hole comprise the steps of:

laminating the substrate'"'"'s first and second surfaces with a liquid, positive tone photoresist, wherein the liquid, positive tone photoresist substantially fills the first and second through-holes;

exposing the liquid, positive tone photoresist in the first through-hole to laser light from the direction of the substrate'"'"'s first surface, wherein the power of the laser light directed into the first through-hole is sufficient to expose the liquid, positive tone photoresist in the first through-hole to a depth at or adjacent to the first internal conductive trace;

exposing the liquid, positive tone photoresist in the second through-hole to laser light from the direction of the substrate'"'"'s first surface, wherein the power of the laser light directed into the second through-hole is sufficient to expose the liquid, positive tone photoresist in the second through-hole to a depth at or adjacent to the third internal conductive trace.

exposing the liquid, positive tone photoresist in the first through-hole to laser light from the direction of the substrate'"'"'s second surface, wherein the power of the laser light directed into the first through-hole is sufficient to expose the liquid, positive tone photoresist in the first through-hole to a depth at or adjacent to the second internal conductive trace;

exposing the liquid, positive tone photoresist in the second through-hole to laser light from the direction of the substrate'"'"'s second surface, wherein the power of the laser light directed into the second through-hole is sufficient to expose the liquid, positive tone photoresist in the second through-hole to a depth at or adjacent to the fourth internal conductive trace.

17. The method as recited in claim 16, wherein the power of the laser light is adjusted on a hole-by-hole basis during the exposing steps.

18. A method comprising the steps of:

providing a substrate having a plurality of insulator layers and a plurality of internal conductive traces, wherein a plurality of through-holes extend completely through the substrate from a first surface of the substrate to a second surface of the substrate, wherein a first one of the through-holes passes through a first and a second of the internal conductive traces, wherein the second internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the first internal conductive trace, wherein a second one of the through-holes passes through a third and a fourth of the internal conductive traces, and wherein the fourth internal conductive trace lies deeper within the substrate with respect to the substrate'"'"'s first surface than does the third internal conductive trace;

plating a first conductive via onto the first through-hole so that the first conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the first internal conductive trace;

plating a second conductive via onto the first through-hole so that the second conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the second internal conductive trace;

plating a third conductive via onto the second through-hole so that the third conductive via extends from the substrate'"'"'s first surface to and terminates substantially at the third internal conductive trace;

plating a fourth conductive via onto the second through-hole so that the fourth conductive via extends from the substrate'"'"'s second surface to and terminates substantially at the fourth internal conductive trace.

19. The method as recited in claim 18, wherein the distance between the first and the second internal conductive traces in the first through-hole is greater than the distance between the third and the fourth internal conductive traces in the second through-hole.