LED PACKAGE STRUCTURE

• US 20100044727A1
• Filed: 06/23/2009
• Published: 02/25/2010
• Est. Priority Date: 08/21/2008
• Status: Abandoned Application

• Current Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Inventors: Hung, Shih-Hao
• Application Number:
  US12/489,439
• Publication Number:
  US 20100044727A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A LED package structure includes an insulating ceramic base, whereon a first surface and a second surface are formed. The LED package structure further includes a casing disposed on the first surface of the insulating ceramic base. A hole is formed on the casing. The LED package structure further includes a heat-dissipating structure connected to the second surface of the insulting ceramic base, at least one LED chip, and at least one conductive circuit disposed inside the casing. The conductive circuit includes a first conductive portion, and a second conductive portion connected to the first conductive portion via the hole and electrically connected to the LED chip.

Claims

1. A LED package structure comprising:

an insulating ceramic base having a first surface and a second surface;

a casing disposed on the first surface of the insulating ceramic base, wherein a hole is formed on the casing;

a heat-dissipating structure arranged on the second surface of the insulting ceramic base;

at least one LED chip arranged on the first surface of the insulting ceramic base; and

at least one conductive circuit disposed inside the casing, wherein the conductive circuit comprises a first conductive portion and a second conductive portion connected to the first conductive portion via the hole and electrically connected to the LED chip.

2. The LED package structure of claim 1 further comprising:

a conductive wire for electrically connecting with the LED chip and the conductive circuit.

3. The LED package structure of claim 1 further comprising:

a connecting layer for fixing the LED chip on the insulating ceramic base.

4. The LED package structure of claim 1, wherein the LED package structure comprises two conductive circuits, and electrode polarities of the two conductive circuits are reverse.

5. The LED package structure of claim 1, wherein the LED chip is installed on the insulating ceramic base in chip on board (COB) technology, flip-chip technology, tackifier method, or eutectic welding technology.

6. The LED package structure of claim 1, wherein a thermal conductivity of the insulating ceramic base is between 30 W/mK and 420 W/mK substantially.

7. The LED package structure of claim 1, wherein the heat-dissipating structure is a thermal module or a metal conductive layer.

8. The LED package structure of claim 7, wherein the metal conductive layer is formed on the insulating ceramic base by reflow soldering method, and the metal conductive layer is made of metal selected from the group consisting of silver, copper, aluminum, and alloy thereof.

9. The LED package structure of claim 1, wherein a reflective region is formed on inner surfaces of the casing and the insulating ceramic base and a reflectivity of the reflective region is between 85% and 100% substantially.

10. The LED package structure of claim 1, wherein the LED package structure comprises a plurality of LED chips electrically connected in series or in parallel.