CARRIER AND OPTICAL SEMICONDUCTOR DEVICE BASED ON SUCH A CARRIER
First Claim
1. A method for manufacturing a carrier (40) for enabling accurate positioning of an optical element (45;
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61) in relation to a optical semiconductor element (41) to be connected to the carrier (40), the method comprising the steps of;
providing (201) an electrically conductive multi-layer carrier base sheet (10) having an upper carrier layer (13), a lower carrier layer (14), and an intermediate carrier layer (12) between said upper and lower carrier layers;
forming (206, 207) an upper conductor structure (22) in said upper and intermediate carrier layers (13, 12); and
providing (208, 209) a patterned insulative spacer layer (26) on an upper carrier layer side of said carrier base sheet (10),wherein;
said insulative spacer layer (26) is patterned such that at least one cavity (27) is formed in which said optical semiconductor element (41) is connectable to said upper conductor structure (22), a depth of said cavity (27) being greater than a height of the optical semiconductor element (41) when connected to said carrier (10); and
said cavity (27) is formed to define a location of said optical element (45;
61) in relation to said optical semiconductor element (41).
6 Assignments
0 Petitions
Accused Products
Abstract
A method for providing, on a carrier (40), an insulative spacer layer (26) which is patterned such that a cavity (27) is formed which enables connection of an optical semiconductor element (41) to the intended conductor structure (22) when placed inside the cavity (27). The cavity (27) is formed such that it, through its shape, extension and/or depth, accurately defines a location of an optical element (45; 61) in relation to the optical semiconductor element (41). Through the provision of such a patterned insulative spacer layer, compact and cost-efficient optical semiconductor devices can be mass-produced based on such a carrier without the need for prolonged development or acquisition of new and expensive manufacturing equipment.
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Citations
22 Claims
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1. A method for manufacturing a carrier (40) for enabling accurate positioning of an optical element (45;
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61) in relation to a optical semiconductor element (41) to be connected to the carrier (40), the method comprising the steps of;
providing (201) an electrically conductive multi-layer carrier base sheet (10) having an upper carrier layer (13), a lower carrier layer (14), and an intermediate carrier layer (12) between said upper and lower carrier layers; forming (206, 207) an upper conductor structure (22) in said upper and intermediate carrier layers (13, 12); and providing (208, 209) a patterned insulative spacer layer (26) on an upper carrier layer side of said carrier base sheet (10), wherein; said insulative spacer layer (26) is patterned such that at least one cavity (27) is formed in which said optical semiconductor element (41) is connectable to said upper conductor structure (22), a depth of said cavity (27) being greater than a height of the optical semiconductor element (41) when connected to said carrier (10); and said cavity (27) is formed to define a location of said optical element (45;
61) in relation to said optical semiconductor element (41).- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14, 15)
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61) in relation to a optical semiconductor element (41) to be connected to the carrier (40), the method comprising the steps of;
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10. A method for manufacturing an optical semiconductor device (50;
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60) having an accurate positioning of an optical element (45;
61) in relation to a optical semiconductor element (41) included in said semiconductor device (50;
60), the method comprising the steps of;providing (401) a carrier (40) including; an electrically conductive multi-layer carrier base sheet (10) having an upper carrier layer (13), a lower carrier layer (14), and an intermediate carrier layer (12) between said upper and lower carrier layers, said upper and intermediate carrier layers having an upper conductor structure (22) formed therein; and a patterned insulative spacer layer (26) arranged on an upper carrier layer side of said carrier base sheet (10), wherein; said insulative spacer layer (26) is patterned such that at least one cavity (27) is formed in which said optical semiconductor element (41) is connectable to said upper conductor structure (22), a depth of said cavity (27) being greater than a height of the optical semiconductor element (41) when connected to said carrier (40); and said cavity (27) is formed to define a location of said optical element (45;
61) in relation to said optical semiconductor element (41);connecting (402) said optical semiconductor element (41) to said upper conductor structure (22;
43) in the cavity (27) formed by said patterned insulative spacer layer (26); andproviding (403;
601) said optical element (45;
61) in said location defined by said patterned insulative spacer layer (26).
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60) having an accurate positioning of an optical element (45;
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16. A carrier (40) for enabling accurate positioning of an optical element (45;
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61) in relation to a optical semiconductor element (41) to be connected to the carrier (40), said carrier comprising;
an electrically conductive multi-layer carrier base sheet (10) having an upper carrier layer (13), a lower carrier layer (14), and an intermediate carrier layer (12) between said upper and lower carrier layers, said upper (12) and intermediate (12) carrier layers having an upper conductor structure (22) formed therein; and a patterned insulative spacer layer (26) arranged on an upper carrier layer side of said carrier base sheet (10), wherein; said insulative spacer layer (26) is patterned such that at least one cavity (27) is formed in which said optical semiconductor element (41) is connectable to said upper conductor structure (22), a depth of said cavity (27) being greater than a height of the optical semiconductor element (41) when connected to said carrier (40); and said cavity (27) is formed to define a location of said optical element (45;
61) in relation to said optical semiconductor element (41).- View Dependent Claims (17, 18, 19, 20, 21, 22)
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61) in relation to a optical semiconductor element (41) to be connected to the carrier (40), said carrier comprising;
Specification