CMOS IMAGE SENSOR PACKAGE AND CAMERA MODULE USING SAME

• US 20100044815A1
• Filed: 05/17/2009
• Published: 02/25/2010
• Est. Priority Date: 08/20/2008
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: CHANG, Jen-Tsorng
• Application Number:
  US12/467,295
• Publication Number:
  US 20100044815A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14629 Reflectors

Abstract

An image sensor package includes a cover glass, a color filter layer, an image sensor chip, and a reflecting layer. The cover glass includes a first surface and a second surface at opposite sides thereof. The color filter layer is formed on the first surface of the cover glass. The image sensor chip includes a silicon layer formed on the second surface of the cover glass, a number of pixel regions formed on a third surface of the silicon layer facing away from the cover glass, and a number of bumps formed on the third surface of the silicon layer, the bumps is capable of for electrically connecting the image sensor chip to a circuit board. The reflecting layer covers the pixel regions of the image sensor chip.

Claims

1. An image sensor package comprising:

a cover glass comprising a first surface and a second surface at opposite sides thereof;

a color filter layer formed on the first surface of the cover glass;

an image sensor chip comprising;

a silicon layer formed on the second surface of the cover glass, the silicon layer comprising a third surface facing away from the cover glass;

a plurality of pixel regions formed on the third surface of the silicon layer; and

a plurality of bumps formed on the third surface of the silicon layer, the bumps capable of electrically connecting the image sensor chip to a circuit board, and

a reflecting layer covering the plurality of pixel regions of the image sensor chip.

2. The image sensor package of claim 1, wherein the cover glass is heat-resistant glass.

3. The image sensor package of claim 2, wherein the silicon layer is a deposition layer on the cover glass.

4. The image sensor package of claim 1, wherein the thickness of the silicon layer is in a range from approximately 0.1 μ

m to approximately 100 μ

m.

5. The image sensor package of claim 1, wherein the silicon layer is substantially transparent.

6. The image sensor package of claim 1, further comprising a micro-lens array arranged between the plurality of pixel regions and the reflecting layer, the micro-lens array comprising a plurality of micro lenses covering the plurality of pixel regions, respectively.

7. The image sensor package of claim 6, wherein the diameter of each micro lens is larger than the corresponding size of the respective pixel region.

8. The image sensor package of claim 6, wherein the micro-lens array is made of photoresist material.

9. The image sensor package of claim 1, further comprising a micro-lens array overlaying a surface of the color filter layer that is farthest away from the cover glass.

10. The image sensor package of claim 1, wherein the color filter layer comprises a plurality of red color filters, a plurality of green color filters, and a plurality of blue color filters.

11. A camera module comprising:

a barrel;

at least one lens received in the barrel; and

an image sensor package located at the image side of the at least one lens, the image sensor package comprising;

a cover glass comprising a first surface and a second surface at opposite sides thereof, the first surface facing toward the object side of the camera module;

a color filter layer formed on the first surface of the cover glass;

an image sensor chip comprising;

a silicon layer formed on the second surface of the cover glass, the silicon layer comprising a third surface facing away from the cover glass;

a plurality of pixel regions formed on the third surface of the silicon layer; and

a plurality of bumps formed on the third surface of the silicon layer, the bumps capable of electrically connecting the image sensor chip to a circuit board, and

a reflecting layer covering the plurality of pixel regions of the image sensor chip.

12. The camera module of claim 11, wherein the cover glass is a heat-resistant glass.

13. The camera module of claim 12, wherein the silicon layer is a deposition layer on the cover glass.

14. The camera module of claim 11, wherein the thickness of the silicon layer is in a range from approximately 0.1 μ

m to approximately 100 μ

m.

15. The camera module of claim 11, wherein the silicon layer is substantially transparent.

16. The camera module of claim 11, further comprising a micro-lens array arranged between the plurality of pixel regions and the reflecting layer, the micro-lens array comprising a plurality of micro lenses covering the plurality of pixel regions, respectively.

17. The camera module of claim 16, wherein the diameter of each micro lens is larger than the corresponding size of the respective pixel region.

18. The camera module of claim 16, wherein the micro-lens array is made of photoresist material.

19. The camera module of claim 11, further comprising a micro-lens array overlaying a surface of the color filter layer that is farthest away from the cover glass.

20. The camera module of claim 11, wherein the color filter layer comprises a plurality of red color filters, a plurality of green color filters, and a plurality of blue color filters.