SHIELDED MULTI-LAYER PACKAGE STRUCTURES

• US 20100044840A1
• Filed: 10/27/2009
• Published: 02/25/2010
• Est. Priority Date: 06/19/2007
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Lin, Jong-Kai, Tang, Jinbang
• Granted Patent: US 8,004,068 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0215 Metallic fillers
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Abstract

Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.

Claims

1. A shielded multi-layer package structure comprising:

a conductive encapsulant structure;

an insulating layer;

a plurality of electronic components embedded within the conductive encapsulant structure, wherein the insulating layer is provided between the conductive encapsulant structure and the electronic components;

multi-layer circuitry provided on and in electrical communication with the plurality of electronic components; and

at least one shielding via extending through the multilayer circuitry such that it contacts the conductive encapsulant.

2. The package structure of claim 1, wherein the insulating layer comprises a polymer layer.

3. The package structure of claim 2, wherein the polymer layer includes a polyimide layer.

4. The package structure of claim 1, wherein the conductive encapsulant structure comprises a conductive plastic mold compound.

5. The package structure of claim 1, wherein the conductive encapsulant structure comprises a material selected from a group consisting of aluminum, copper, nickel iron, tin, and zinc.

6. The package structure of claim 1, further including a top shielding layer provided on the conductive encapsulant structure.

7. A shielded multi-layer package structure comprising:

a substrate;

a plurality of electronic components having first surfaces and second surfaces that are opposite the first surfaces;

an insulating layer with first portions disposed in contact with the second surfaces of the plurality of electronic components and with second portions between the first surfaces of adjacent ones of the plurality of electronic components;

an electrically conductive encapsulant structure over the insulating layer, resulting in a structure in which the first portions of the insulating layer are positioned between the conductive encapsulant structure and the second surfaces of the plurality of electronic components;

multi-layer circuitry over, and in electrical communication with, the first surfaces of the plurality of electronic components; and

a shielding via through the multilayer circuitry and the second portions of the insulating layer, wherein the shielding via contacts the conductive encapsulant structure.

8. The package structure of claim 7, further including conductive, non-contiguous shielding regions in contact with the first surfaces of the plurality of electronic components.

9. The package structure of claim 7, wherein the conductive encapsulant structure comprises a conductive plastic mold compound.

10. The package structure of claim 7, wherein the conductive encapsulant structure comprises a material selected from a group consisting of aluminum, copper, nickel iron, tin, and zinc.

11. The package structure of claim 7, wherein the insulating layer comprises a polymer layer.

12. The package structure of claim 11, wherein the polymer layer includes a polyimide layer.

13. The package structure of claim 7, the multilayer circuitry includes at least one signal via for transmitting signals between the plurality of components.

14. A shielded multi-layer package structure comprising:

a plurality of electronic components having first surfaces and second surfaces that are opposite the first surfaces;

an insulating layer formed between the plurality of electronic components and over the second surfaces of the plurality of electronic components such that first portions of the insulating layer are coplanar with the first surfaces;

an electrically conductive encapsulant structure within which the insulating layer and the plurality of electronic components are embedded such that second portions of the insulating layer are provided between the electrically conductive encapsulant structure and the second surfaces of the electronic components; and

at least one shielding via formed through the first portions of the insulating layer and in electrical contact with the electrically conductive encapsulant structure.

15. The package structure of claim 14, further including multi-layer circuitry in electrical communication with the plurality of electronic components.

16. The package structure of claim 14, further including conductive, non-contiguous shielding regions in contact with the plurality of electronic components.

17. The package structure of claim 14, wherein the conductive encapsulant structure comprises a conductive plastic mold compound.

18. The package structure of claim 14, wherein the conductive encapsulant structure comprises a material selected from a group consisting of aluminum, copper, nickel iron, tin, and zinc.

19. The package structure of claim 14, wherein the insulating layer includes a polymer layer.

20. The package structure of claim 19, wherein the polymer layer includes a polyimide layer.