Method of integrating an identification circuit into a data medium
First Claim
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1. Method for integrating an identification circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data consisting in:
- etching in the part without data of the conductive layer, at least a radiating slot forming an antenna, andcoupling an integrated circuit to the slot.
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Abstract
The present invention relates to a method for integrating an identifier circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data. The method consists in etching in the part without data of the conductive layer, at least one resonating slot forming an antenna and coupling an integrated circuit to the slot.
15 Citations
10 Claims
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1. Method for integrating an identification circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data consisting in:
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etching in the part without data of the conductive layer, at least a radiating slot forming an antenna, and coupling an integrated circuit to the slot. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. Data medium formed by at least a dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data a part without data said medium further comprising:
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an antenna formed by a radiating slot etched in the part without data of the conductive layer and, an identification circuit formed by a chip coupled to the slot.
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Specification