×

Method of integrating an identification circuit into a data medium

  • US 20100045438A1
  • Filed: 06/13/2007
  • Published: 02/25/2010
  • Est. Priority Date: 06/28/2006
  • Status: Active Grant
First Claim
Patent Images

1. Method for integrating an identification circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data consisting in:

  • etching in the part without data of the conductive layer, at least a radiating slot forming an antenna, andcoupling an integrated circuit to the slot.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×