Mirror device and MEMS device comprising layered electrode

• US 20100046062A1
• Filed: 10/30/2009
• Published: 02/25/2010
• Est. Priority Date: 11/01/2003
• Status: Active Grant

• Current Assignee: Ignite USA (Ignite), Olympus Corporation
• Original Assignee: Olympus Corporation, Silicon Quest Kabushiki-Kaisha
• Inventors: Maeda, Yoshihiro, Sugimoto, Naoya, Ichikawa, Hirotoshi, Ishii, Fusao
• Granted Patent: US 8,064,123 B2
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H04N 5/7458 the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]
• CPC Class Codes: H04N 9/312 Driving therefor driving of electronic spatial light modulators in displays other than projection devices G09G3/34, G09G3/36; control of liquid crystal elements G02F1/133; control of micromechanical modulators G02B26/08

Abstract

The present invention provides an image display system implemented with a micro-electromechanical system (MEMS) device formed and supported on a substrate functioning as a spatial light modulator wherein the MEMS device further comprises a drive circuit disposed on the substrate; a micromirror functioning as a movable electrode supported on a deflectable hinge extended from the substrate; a stationary electrode disposed on the substrate and connected to the drive circuit to receive signals therefrom, wherein the stationary electrode comprises a first electrode, a second electrode and an insulation layer, wherein the insulation layer is disposed between the first electrode and second electrode.

Claims

1. An image display system implemented with a micro-electromechanical system (MEMS) device formed and supported on a substrate functioning as a spatial light modulator wherein the MEMS device further comprising:

a drive circuit disposed on the substrate;

a micromirror functioning as a movable electrode supported on a deflectable hinge extended from the substrate;

a stationary electrode disposed on the substrate and connected to the drive circuit to receive signals therefrom, wherein the stationary electrode comprises a first electrode, a second electrode and an insulation layer, wherein the insulation layer is disposed between the first electrode and second electrode.

2. The MEMS device according to claim 1 further comprising:

a protective layer covering outer surfaces of the stationary electrode.

3. The MEMS device according to claim 1, wherein:

the first electrode and second electrode are connected respectively to two different signal lines of the drive circuit.

4. The MEMS device according to claim 1, wherein:

the drive circuit comprises a memory circuit, wherein at least one of the first and second electrodes is connected to the memory circuit.

5. The MEMS device according to claim 1, wherein:

at least one of the first electrode and second electrode is connected to a ground (GND) terminal of the drive circuit.

6. The MEMS device according to claim 1, wherein:

the insulation layer is composed of a material comprising silicon (Si).

7. The MEMS device according to claim 1, wherein:

the deflectable hinge is composed of a material comprising silicon (Si) and doped with dopants comprising a group III or group V material.

8. The MEMS device according to claim 1, wherein:

at least one of the first electrode and second electrode is implemented as a hinge electrode and electrically connected through the deflectable hinge to the micromirror functioning as the movable electrode.

9. The MEMS device according to claim 2, wherein:

the protective layer further comprising an opening.

10. The MEMS device according to claim 2, wherein:

the protective layer has an electrical resistance higher than a resistance of the deflectable hinge.

11. The MEMS device according to claim 2, further comprising:

a stiction protection layer covers the protective layer.

12. The MEMS device according to claim 2, wherein:

the protective layer is composed of a material comprising silicon (Si).

13. An image display system implemented with a micro-electromechanical system (MEMS) device formed and supported on a substrate functioning as a spatial light modulator (SLM) wherein the MEMS device further comprising:

a drive circuit disposed on the substrate;

a micromirror functioning as a movable electrode supported on a deflectable hinge extended from the substrate;

a stationary electrode disposed on the substrate and connected to the drive circuit to receive signals therefrom, wherein the first electrode is electrically connected to the movable electrode and the second electrode applies a voltage to drive and move the micromirror functioning as the moveable electrode.

14. The MEMS device according to claim 13, wherein:

at least a part of the first electrode is configured as a layered electrode and at least a part of the second electrode is also configured as a layered electrode.

15. The MEMS device according to claim 13, comprising:

an insulation layer is disposed between the first electrode and second electrode.

16. The MEMS device according to claim 13, wherein:

at least one of the first electrode and second electrode is controlled to have an electrically floating voltage.

17. The MEMS device according to claim 13, wherein:

the first electrode and second electrode are connected respectively to two different signal lines of the drive circuit.

18. The MEMS device according to claim 13, wherein:

the drive circuit comprises a memory circuit, wherein at least one of the first and second electrodes is connected to the memory circuit.

19. An image display system implemented with a mirror device formed and supported on a substrate wherein the mirror device further comprising:

a drive circuit disposed on the substrate;

a plurality of mirrors each supported on a deflectable hinge extended from to the substrate; and

a plurality of drive electrodes, each corresponds to and drives one of the mirrors, wherein each of the drive electrodes comprises a mirror-side electrode unit disposed on a mirror side and a substrate-side electrode unit disposed on a substrate side, wherein the mirror-side electrode unit and the substrate-side electrode unit are connected respectively to two different signal lines of the drive circuit.

20. The mirror device according to claim 19, wherein:

at least a part of the mirror-side electrode unit is configured as a layered electrode and at least a part of the substrate-side electrode unit is also configured as a layered electrode.

21. The mirror device according to claim 19, comprising:

a dielectric body layer disposed between the mirror-side electrode unit and substrate-side electrode unit.

22. The mirror device according to claim 19, wherein:

the drive circuit is connected to each of the mirror-side electrode unit of each of the mirrors through a different memory circuit, wherein the substrate-side electrode unit is connected to the drive circuit via a signal line commonly connected to a plurality of drive electrodes.

23. The mirror device according to claim 19, wherein:

the drive circuit comprises first memory circuit and second memory circuit, wherein the mirror-side electrode unit is connected to the first memory circuit, and the substrate-side electrode unit is connected to the second memory circuit.

24. The mirror device according to claim 19, wherein:

the drive circuit comprises a capacitor, wherein at least one of the mirror-side electrode unit and substrate-side electrode unit is connected to the capacitor.

25. An image display system implemented with a micro-electromechanical system (MEMS) device disposed on a substrate functioning as a spatial light modulator (SLM) wherein the MEMS device further comprising:

a drive circuit comprises a wiring layer disposed on the substrate;

an upper electrode disposed on the substrate;

a Via layer having a Via connection opening therethrough for connecting the wiring layer to the upper electrode; and

a lower electrode disposed in the via layer below the upper electrode, wherein an insulation layer is disposed between the upper electrode and lower electrode.

26. The MEMS device according to claim 25, wherein:

the lower electrode is composed of a material same as the Via layer.

27. The MEMS device according to claim 25, wherein:

the upper electrode is composed of a material different from the lower electrode.