LED COOLING SYSTEM

• US 20100046231A1
• Filed: 02/29/2008
• Published: 02/25/2010
• Est. Priority Date: 03/01/2007
• Status: Abandoned Application

• Current Assignee: Hawkeye Distributing, LLC
• Original Assignee: Hawkeye Distributing, LLC
• Inventors: Medinis, David M.
• Application Number:
  US12/529,486
• Publication Number:
  US 20100046231A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21V 29/56 using liquid coolants F21V29/51 takes precedence
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

The invention relates to a LED cooling system that effects cooling of the LED'"'"'s during use, and helps the LED'"'"'s have a longer operating function, and uses less electricity for the LED'"'"'s to operate. The use of cooling also provides a steadier light and has greater efficiency.

Claims

1. A high intensity LED light emission diode assembly including a metallic base which is powered to produce a cone of semi-coherent light in a lamberton distribution, which is characterized by:

a printed circuit board mounting the LED whereby the metallic base of the LED extends through said printed circuit board to achieve mounting,

a metallic heat layer mounted on the side of the printed board opposite to the LED, and in intimate contact with the metallic base of the LED, and

means to pass a fluid adjacent to the heat sink layer to absorb heat from the heat sink layer, and to effect operation of the LED at its optimum effect temperature.

2. A diode assembly according to claim 1 where the LED is operated with an electric draw of approximately 1 amp, and puts out a light intensity of between 720 to 1200 lumens.

3. A diode assembly according to claim 1 where the printed circuit board is between 1.0 mm to 1.5 mm in thickness and the heat sink layer is between 1.0 mm to 2.5 mm in thickness, and the fluid is water passing the heat sink layer at between 300 to 500 ml per minutes through an opening which is between 1.0 mm to 1.75 mm in diameter.

4. A diode assembly according to claim 3 where the diode assembly emits a conical light pattern of approximately 40 degrees, and further includes a focus lens to focus the 40 degree beam as desired.