DIRECTIONAL SILICON CONDENSOR MICROPHONE HAVING ADDITIONAL BACK CHAMBER
First Claim
1. A silicon condenser microphone comprising:
- a case;
a substrate connected to the case;
the substrate and the case defining an interior space,a MEMS chip located in the interior space,the MEMS chip having a first back chamber,a chamber case located in the interior space,a chamber case having a second back chamber,the chamber case located on top of the substrate,the MEMS chip being located next to the chamber case such that the first back chamber and the second back chamber are connected.
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Accused Products
Abstract
A directional silicon condenser microphone having an additional back chamber is disclosed. The directional silicon condenser microphone in accordance with the present invention comprises a case having a front sound hole for passing through a front sound; a acoustic delay device for delaying a phase of a sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for bonding the substrate to the case, and a rear sound hole for passing through a rear sound; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.
120 Citations
13 Claims
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1. A silicon condenser microphone comprising:
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a case; a substrate connected to the case; the substrate and the case defining an interior space, a MEMS chip located in the interior space, the MEMS chip having a first back chamber, a chamber case located in the interior space, a chamber case having a second back chamber, the chamber case located on top of the substrate, the MEMS chip being located next to the chamber case such that the first back chamber and the second back chamber are connected. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification