METHOD OF FORMING A COATING ON A SURFACE OF A SUBSTRATE
First Claim
1. A method of forming a non-stick coating on a surface of a substrate, said method comprising:
- (a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;
(b) coating the bonding material with a layer of substantially uniform copper particles, wherein the copper particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and
(c) at least partially curing the wet bonding material and the substantially uniform copper particles, such that a plurality of the copper particles are substantially submerged Within the cured bonding material and at least part of said copper particles protrude from the cured bonding material.
3 Assignments
0 Petitions
Accused Products
Abstract
A reinforcing underlayment including dry uniform particles evenly applied to a wet bonding material layer on a surface of a substrate. The substrate, including the layers, is then cured to harden the one or more of the layers. A final coating or topcoat is applied to the cured surface of the substrate. The dry particles are evenly distributed onto the bonding material layer creating a uniform surface for subsequent coatings. The dry particles increase the strength of the liquid coatings increasing solid particle density within the coating system and thereby imparting properties not available for the liquid coatings. The present invention enables a user to easily introduce very heavy, dense, strong particles into a liquid coating and allows the user to apply very dense, heavy particles into and onto a wet bonding material layer followed by a subsequent wet topcoat layer which is cured as one contiguous material with reinforcement and underlayment strengthening coming from the added, dry particles.
78 Citations
2 Claims
-
1. A method of forming a non-stick coating on a surface of a substrate, said method comprising:
-
(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate; (b) coating the bonding material with a layer of substantially uniform copper particles, wherein the copper particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and (c) at least partially curing the wet bonding material and the substantially uniform copper particles, such that a plurality of the copper particles are substantially submerged Within the cured bonding material and at least part of said copper particles protrude from the cured bonding material. - View Dependent Claims (2)
-
Specification