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Tracking Thermal Mini-Cycle Stress

  • US 20100049466A1
  • Filed: 08/20/2008
  • Published: 02/25/2010
  • Est. Priority Date: 08/20/2008
  • Status: Active Grant
First Claim
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1. A method, in a data processing system, for monitoring temperature excursions an assembly experiences over a life of the assembly, the method comprising:

  • determining if the assembly has been in service beyond a predetermined end of life objective;

    responsive to the assembly failing to be in service beyond the predetermined end of life objective, reading a new temperature value associated with the assembly;

    computing a modifier value for a figure of merit (FOM) value;

    adding the modifier value to a cumulative figure of merit value;

    comparing the cumulative figure of merit value to a cumulative stress figure of merit budget; and

    responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, implementing an identified stress management solution.

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