VARIABLE CONDUCTANCE HEAT PIPE

• US 20100051254A1
• Filed: 08/27/2009
• Published: 03/04/2010
• Est. Priority Date: 08/28/2008
• Status: Abandoned Application

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Nagayasu, Tetsuya, Hironaka, Shingo, Kitazaki, Kuraki, Sato, Yukio, IPPOSHI, Shigetoshi
• Application Number:
  US12/548,936
• Publication Number:
  US 20100051254A1
• Time in Patent Office: Days
• US Class Current: 165/274
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: F28F 13/14 by endowing the walls of conduits with zones of different degrees of conduction of heat
• CPC Class Codes: G03F 7/70891 Temperature
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Abstract

A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed. The sealed container includes a heat receiving portion to which an element to be cooled is provided, and heat radiating portion. An amount of heat is supplied to the heat receiving portion when the element to be cooled is in a waiting state.

Claims

1. A variable conductance heat pipe comprising a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container including a heat receiving portion to which an element to be cooled is provided, and heat radiating portion,

wherein an amount of heat is supplied to the heat receiving portion when the element to be cooled is in a waiting state.

2. The variable conductance heat pipe according to claim 1,

wherein the amount of heat supplied to the heat receiving portion is an amount which makes a temperature of the heat receiving portion when the element to be cooled is in the waiting state to become a median value or higher, the median value being a median of a temperature Tr at which the element to be cooled operates and an ambient temperature Te.

3. The variable conductance heat pipe according to claim 2, further comprising a heater which supplies the heat receiving portion or the element to be cooled with an amount of heat which makes the temperature of the heat receiving portion when the element to be cooled is in the waiting state to become the median value or higher.

4. The variable conductance heat pipe according to claim 2,

wherein when the element to be cooled is in the waiting state, the element to be cooled generates an amount of heat which makes the temperature of the heat receiving portion to become the median value or higher.

5. The variable conductance heat pipe according to claim 3, further comprising a cooler provided to the heat radiating portion,

wherein the heater and the cooler cooperatively perform output control.

6. The variable conductance heat pipe according to claim 4, further comprising a cooler provided to the heat radiating portion,

wherein the element to be cooled and the cooler cooperatively perform output control.

7. The variable conductance heat pipe according to claim 1,

wherein the element to be cooled is covered with a heat insulating material.

8. The variable conductance heat pipe according to claim 3,

wherein the heat receiving portion is covered with a heat insulating material.

9. The variable conductance heat pipe according to claim 1,

wherein the element to be cooled is a semi-conductor laser device.