SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• US 20100051597A1
• Filed: 08/26/2009
• Published: 03/04/2010
• Est. Priority Date: 08/27/2008
• Status: Active Grant

• Current Assignee: Kokusai Electric Corp.
• Original Assignee: Hitachi Kokusai Electric Incorporated (Hitachi, Ltd.)
• Inventors: Morita, Shinya, Nakada, Takayuki, Sada, Koichi, Matsuda, Tomoyuki
• Granted Patent: US 8,076,615 B2
• Time in Patent Office: Days
• US Class Current: 219/201
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A substrate processing apparatus comprises: an outer tube; a manifold connected to the outer tube and made of a non-metal material; an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein; a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube; a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.

Claims

1. A substrate processing apparatus comprising:

an outer tube;

a manifold connected to the outer tube and made of a non-metal material;

an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein;

a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube;

a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and

a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.

2. The substrate processing apparatus of claim 1, wherein an exhaust pipe is installed in the outer tube or the manifold, and a portion of the heat absorption member facing the exhaust pipe of the heat absorption member comprises a notch part that is notched upward.

3. The substrate processing apparatus of claim 1, wherein a stepped portion is formed at an upper part of the manifold;

a first placement part on which the inner tube is placed is formed at a lower part of the stepped portion;

a second placement part on which the heat absorption member is placed is formed at an upper part of the stepped portion; and

a movement restriction unit is installed in the second placement part such that movement of the heat absorption member is restricted.

4. The substrate processing apparatus of claim 1, wherein a stepped portion is formed at an upper part of the manifold;

a first placement part on which the inner tube is placed is formed at a lower part of the stepped portion;

a second placement part on which the heat absorption member is placed is formed at an upper part of the stepped portion;

an inner surface of the heat absorption member is installed spaced apart from an outer surface of the inner tube;

the heat absorption member is installed from the second placement part across a bottom surface installed at the opening side of the inner tube placed in the first placement part;

a notch part cut radially is formed in the bottom surface of the heat absorption member; and

a movement restriction member is installed in the notch part such that movement of the heat absorption member is restricted.

5. The substrate processing apparatus of claim 1, wherein the heat absorption member comprises a protrusion part that is inserted into a groove provided in the manifold.

6. The substrate processing apparatus of claim 1, wherein the heat absorption member extends at least to a position that shields a heating wire connecting a top end of a heating element, which is installed in the heating device to heat the substrate, and the seal member.

7. The substrate processing apparatus of claim 1, wherein the movement restriction member comprises a bolt.

8. The substrate processing apparatus of claim 7, wherein the bolt is installed so that gap is provided between a head part of the bolt and a bottom surface of the heat absorption member.

9. A substrate processing apparatus comprising:

an outer tube;

a manifold connected to the outer tube and made of a non-metal material;

an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein;

a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube;

a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and

a press member configured to press a bottom end of the inner tube,

wherein a guard part is formed at a lower outer side of the inner tube,

the manifold comprises;

an inner tube placement part on which the inner tube is placed;

a protrusion part formed at a more outer periphery than the inner tube placement part and formed higher than the height of the guard part with respect to the inner tube placement part; and

a groove part installed at a more outer periphery than the protrusion part, and

one end of the press member is inserted into the protrusion part, and the other end of the press member is inserted into the groove part.