NONCONTACT IC TAG LABEL AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A noncontact IC tag label, comprising:
- an electroconductive layer having a required antenna pattern shape;
an IC chip mounted on one face of the electroconductive layer;
a surface protection sheet supporting the electroconductive layer and the IC chip from one face side of the electroconductive layer, via a first pressure-sensitive adhesive layer; and
an adhesive resin layer provided on the other face of the electroconductive layer, the adhesive resin layer being of the same shape as the antenna pattern shape of the electroconductive layer;
wherein the adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material.
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Accused Products
Abstract
This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer 6 of a required antenna pattern shape, an IC chip 3 mounted on one face of the electroconductive layer 6, and a surface protection sheet 4 supporting the electroconductive layer 6 and the IC chip 3 from a side of the one face of the electroconductive layer 6 via a first pressure-sensitive adhesive layer 5. An adhesive resin layer 7 having the same shape as the antenna pattern shape of the electroconductive layer 6 is provided on the other face of the electroconductive layer 6. The adhesive resin layer 7 is temporarily bonded in separable manner onto a release paper 9 formed from paper or a plastic base material.
57 Citations
18 Claims
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1. A noncontact IC tag label, comprising:
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an electroconductive layer having a required antenna pattern shape; an IC chip mounted on one face of the electroconductive layer; a surface protection sheet supporting the electroconductive layer and the IC chip from one face side of the electroconductive layer, via a first pressure-sensitive adhesive layer; and an adhesive resin layer provided on the other face of the electroconductive layer, the adhesive resin layer being of the same shape as the antenna pattern shape of the electroconductive layer; wherein the adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 16)
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8. A method for manufacturing a noncontact IC tag label, the method comprising the steps of:
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setting up into position a release paper formed from paper or a plastic base material, the release paper having a release surface; bringing an antenna material inclusive of an electroconductive layer and a thermo adhesive resin layer into firm contact with the release surface of the release paper with the thermo adhesive resin layer oriented towards the release surface; temporarily bonding the electroconductive layer and thermo adhesive resin layer of the antenna material onto the release surface by firstly die-cutting the electroconductive layer and the thermo adhesive resin layer into a shape of an antenna pattern, from a side the electroconductive layer is disposed down to the release surface, by use of an antenna-cutting die having a heat source, and then fusing the thermo adhesive resin layer; removing sections other than the antenna pattern of the die-cut antenna material; mounting an IC chip at a required position on the antenna pattern; stacking a surface protection sheet over the IC chip via a first pressure-sensitive adhesive layer; and die-cutting the surface protection sheet and the first pressure-sensitive adhesive layer into an outline shape of the noncontact IC tag label by use of a label-cutting die. - View Dependent Claims (10, 11)
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9. A method for manufacturing a noncontact IC tag label, the method comprising the steps of:
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setting up into position a release paper formed from paper or a plastic base material, the release paper having a release surface; bonding an antenna material inclusive of an electroconductive layer and a second pressure-sensitive adhesive layer onto the release surface of the release paper with the second pressure-sensitive adhesive layer oriented towards the release surface; die-cutting the electroconductive layer and second pressure-sensitive adhesive layer of the antenna material into a shape of an antenna pattern, from a side the electroconductive layer is disposed down to the release surface, by use of an antenna-cutting die; removing sections other than the antenna pattern of the die-cut antenna material; mounting an IC chip at a required position on the antenna pattern; stacking a surface protection sheet over the IC chip via a first pressure-sensitive adhesive layer; and die-cutting the surface protection sheet and the first pressure-sensitive adhesive layer into an outline shape of the noncontact IC tag label by use of a label-cutting die. - View Dependent Claims (12, 17)
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13. A method for manufacturing a noncontact IC tag label, the method comprising the steps of:
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setting up into position a release paper formed from paper or a plastic base material, the release paper having a release surface; bringing an antenna material inclusive of an electroconductive layer and a thermo adhesive resin layer into firm contact with the release surface of the release paper with the thermo adhesive resin layer oriented towards the release surface; temporarily bonding the electroconductive layer and thermo adhesive resin layer of the antenna material onto the release surface, by firstly die-cutting the electroconductive layer and the thermo adhesive resin layer into a shape of an antenna pattern, from a side the electroconductive layer is disposed down to the release surface, by use of an antenna-cutting die having a heat source, and then fusing the thermo adhesive resin layer; removing sections other than the antenna pattern of the die-cut antenna material; connecting an electroconductive layer including an IC chip previously mounted thereon and formed upon a surface protection sheet via a first pressure-sensitive adhesive layer, to an upper face of the antenna pattern; and die-cutting the surface protection sheet and the first pressure-sensitive adhesive layer into an outline shape of the noncontact IC tag label by use of a label-cutting die. - View Dependent Claims (15)
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14. A method for manufacturing a noncontact IC tag label, the method comprising the steps of:
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setting up into position a release paper formed from paper or a plastic base material, the release paper having a release surface; bonding an antenna material inclusive of an electroconductive layer and a second pressure-sensitive adhesive layer onto the release surface of the release paper with the second pressure-sensitive adhesive layer oriented towards the release surface; die-cutting the electroconductive layer and second pressure-sensitive adhesive layer of the antenna material into a shape of an antenna pattern, from a side the electroconductive layer is disposed down to the release surface, by use of an antenna-cutting die; removing sections other than the antenna pattern of the die-cut antenna material; connecting an electroconductive pattern layer including an IC chip previously mounted thereon and formed upon a surface protection sheet via a first pressure-sensitive adhesive layer, to an upper face of the antenna pattern; and die-cutting the surface protection sheet and the first pressure-sensitive adhesive layer into an outline shape of the noncontact IC tag label by use of a label-cutting die. - View Dependent Claims (18)
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Specification